Foxconn · 16 hours ago
Thermal Field Application Engineer
Santa Clara, CA, US
Full-time
Onsite
Mid Level
3+ years expFoxconn E BG Group is the world’s largest electronics manufacturer and leading provider of technological solutions. The Thermal Field Application Engineer provides technical support for customer design and engineering teams, acting as a bridge between R&D and client-facing functions to ensure successful product design and deployment.
Consumer ElectronicsElectronicsHardwareInformation TechnologyManufacturingProduct DesignSoftware
Responsibilities
Provide technical support to customers on liquid-cooling modules, liquid cooling systems, cold plates, manifolds, and related components
Work closely with customers to understand system requirements and provide tailored technical proposals and product recommendations
Lead technical discussions, design reviews, and troubleshooting during product evaluation and deployment
Collaborate with internal R&D, manufacturing, and quality teams to ensure alignment on design specifications and validation plans
Support customer samples, testing coordination, and on-site issue resolution (including possible travel to customer facilities)
Assist in preparing technical documents such as specifications, test reports, presentations, and failure analysis summaries
Collect customer feedback and market trends to provide input for future product development
Support business development teams with technical insights during customer engagement
Qualification
Required
Bachelor's degree or above in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or related fields
3+ years of hands-on experience in liquid cooling, or thermal solution engineering, ideally in the data center, server, or semiconductor industry
Solid understanding of heat transfer principles and liquid cooling system design
Strong problem-solving abilities with the capability to perform root cause analysis
Excellent communication skills and ability to work directly with customers
Willingness to travel domestically and internationally as needed
Fluent in English and Mandarin
Preferred
Experience with thermal simulation tools or test instrumentation is a plus
Preferred experience working with hyperscale data centers, server OEM/ODM, or advanced cooling module suppliers
Preferred knowledge of large-scale thermal system integration and validation processes
Preferred familiarity with manufacturing processes related to cold plates, tubing, and liquid cooling modules
Company
Foxconn
Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) (2317: Taiwan) is the world’s largest electronics manufacturer.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$5.75BKey Investors
Sprint Vc
2025-10-28Post Ipo Debt· $757.58M
2025-08-07Post Ipo Debt· $3.82B
2024-11-20Post Ipo Debt· $1.1B
Leadership Team
S
Shen Tao-pang
Chief Financial Officer
IC Lin
Senior AVP
Recent News
2026-01-22
2026-01-22
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