Apetan Consulting LLC · 15 hours ago
Lead IC Package Design Engineer
San Jose, CA
Contract
Onsite
Lead/Staff
8+ years expApetan Consulting LLC is seeking a Lead Package Design Engineer to take ownership of package design and layout for connectivity products. The role involves driving package substrate design from definition to tape-out, ensuring performance optimization, and collaborating with various engineering teams for successful product deployment.
Information Technology
Responsibilities
Take ownership of package design and layout for our portfolio of connectivity products deployed by the world’s leading cloud service providers and server/networking OEMs
Drive package substrate design from definition to tape-out, including performance optimization, design for manufacturing, and sign-off verification
Guide best practices in APD, reviewing design work for quality and consistency
Work closely with SI/PI, product engineering, and hardware teams to ensure first-pass success
Qualification
Required
BS/MS in Engineering (Electrical, Mechanical, Materials Science, Physics, or related field)
8+ years of experience in Cadence APD/SiP with a track record of independently designing and releasing FCBGA/FCCSP packages from concept to tape-out
Proven experience leading package design efforts, reviewing and mentoring other designers, and setting technical directions
Deep understanding of BGA substrate technologies, stackups, design rules, and assembly processes
Familiarity with package reliability, SI/PI, and design sign-off methodologies
Entrepreneurial, open-minded, and hands-on work ethic with the ability to drive multiple priorities in a dynamic environment
Strong collaboration and communication skills to work effectively across functions and influence outcomes
Expert proficiency in Cadence APD/SiP (this is a must have). Able to design large-body BGAs from concept through tape-out with minimal guidance
Strong knowledge of package BOM integration, layer stackup, padstacks, constraint setup (physical and electrical), SMT component design, and optimization based on SI/PI feedback
Experience running and interpreting DRC/DRV/LVS/DFM checks, generating documentation, and releasing Gerbers/artwork
Ability to conduct feasibility studies such as fan-out, mock-ups, and layer/package size reduction
Understanding of package manufacturing flow, supply chain considerations, reliability, and risk management
Technical leadership in driving new APD design flows, methodologies, and automation (working with vendors or through scripting)
Company
Apetan Consulting LLC
We are a prominent executive search & selection company, providing a wide range of recruitment solutions for various requirements.
201-500 employees
Funding
Current Stage
Growth StageCompany data provided by crunchbase