BAE Systems, Inc. · 18 hours ago
Principle Process Engineer, Wire Bonding
Nashua, NH
Full-time
Onsite
Senior Level, Lead/Staff
$118K/yr - $201K/yr
6+ years expBAE Systems, Inc. is a leading defense, aerospace, and security company dedicated to delivering advanced electronics and innovative solutions. In the Principal Process Engineer role within the Microwave New Product Introduction (NPI) Pilot Line, you will be responsible for developing and optimizing wire bonding processes, providing engineering support, and ensuring quality and efficiency in production. This position requires close collaboration with design teams and an ability to adapt to a fast-paced environment.
Defense & Space
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Work with automated and manual wire and wedge bonding machines, including process development, programming, and optimizing
Provide Process Engineering floor support, guidance, and instruction to operators in support of Microwave module assembly including substrate lamination, component placement, wire bonding and inspection
Perform manufacturing support activities using technical knowledge of generally used assembly practices ensuring the achievement of performance within cost and schedule requirements
Support Preliminary Material Review/Material Review Board (PMR/MRB) for the disposition of discrepant material and determination of root cause/corrective action
Perform quality audits of hardware, PFMEA’s, monitor defects, and track trends
Support/Lead factory continuous improvement activities and projects
Perform coaching, training, and qualification for operators
Ensure timely disposition of hardware and assure thorough root cause analysis of discrepant materials
Create and maintain process documents that will be followed on the factory floor
Create and maintain production routers for material moving through the factory
Maintain assigned projects and tasks to ensure timely completion of required needs
Qualification
Required
Bachelors Degree in Engineering or in a related field
6+ years work experience in microelectronics
3+ years' experience in wire/wedge bonding microelectronic subassemblies, preferably in programming autobonders
Process or manufacturing engineering background with strong analytical, problem-solving, and interpersonal skills, have proven teamwork and leadership skills, and be able to work across 'boundaries' with multiple functions and program teams
Exhibit sound interpersonal skills involving interfacing, coordinating and negotiating with company personnel at all levels, customers and suppliers
Effectively communicate status on technical aspects of manufacturing in program production meetings
Ability to understand, analyze, and resolve complex technical problems
Ability to work self-directed
Communicate effectively both orally and in writing
Must be proficient in Microsoft Word and Excel
Preferred
Active DOD Secret Security Clearance
PPV/FAI industry experience
Statistical Analysis including SPC, CpK, DOE
Root Cause and Corrective Action methodology
Green Belt and Lean manufacturing training and demonstrated ability to apply these principles
Familiarity with IPC and Mil-Stds
Prior experience working within a DoD environment
Development of software tools
Benefits
Health, dental, and vision insurance
Health savings accounts
A 401(k) savings plan
Disability coverage
Life and accident insurance
Employee assistance program
Legal plan
Discounts on things like home, auto, and pet insurance
Paid time off
Paid holidays
Paid parental leave
Military leave
Bereavement leave
Any applicable federal and state sick leave
Company recognition program to receive monetary or non-monetary recognition awards
Company
BAE Systems, Inc.
Improving the future and protecting lives is an ambitious mission, but it’s what we do. BAE Systems, Inc. is the U.S.
10001+ employees
Funding
Current Stage
Late StageLeadership Team
Tom Arseneault
President & Chief Executive Officer, BAE Systems, Inc.
Don Widener, PhD
Chief Technology Officer, Intelligence Solutions
Recent News
2024-05-12
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2024-05-08
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