Packaging Engineer E5 jobs in United States
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Applied Materials · 5 hours ago

Packaging Engineer E5

Applied Materials is a global leader in materials engineering solutions, and they are seeking a Packaging Engineer E5 to develop new modules in Advanced Semiconductor Packaging. The role involves program managing customer engagements, developing new modules, and representing Integration Module Solutions as a module specialist.

ElectronicsManufacturingSemiconductorSoftware
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H1B Sponsor Likelynote

Responsibilities

Program Managing customer engagements in Advanced Packaging, with focus on thermal management, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time
Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging
Filing new patentable developments
Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and Senior/Managing directors across Applied’s business units, including the packaging business unit
Helping structure and maintain Applied’s roadmap in Packaging modules
Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied
Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging
Creating roadmaps for some packaging applications and helping to shepherd Applied’s product portfolio
Lead project across organization and culture in a fast-paced environment
Self-starter, team player and able to work independently with minimal supervision

Qualification

Wafer to wafer bondingComplex heterogeneous packagingDie to wafer bondingProgram managementTimeline managementBudget ManagementOralInterpersonal skillsLeadershipWritten communications

Required

MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent
wafer to wafer bonding - including fusion and hybrid bonding
complex heterogeneous wafer level packaging
TSV
die to wafer bonding
advanced substrate and chip on wafer stacking
Program management
Timeline management
Budget Management
Strong Interpersonal skills
Leadership
Oral and written communications in English

Benefits

Comprehensive benefits package
Participation in a bonus and a stock award program

Company

Applied Materials

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Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.

H1B Sponsorship

Applied Materials has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)

Funding

Current Stage
Public Company
Total Funding
$2.1B
Key Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M

Leadership Team

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Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
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Tony Chiang, Ph.D
VP, CTO Applied AI
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Company data provided by crunchbase