Applied Materials · 20 hours ago
Process Integration engineer - E5
Santa Clara, CA
Full-time
Onsite
Senior Level
$176K/yr - $242K/yrApplied Materials is a global leader in materials engineering solutions used to produce advanced chips and displays. The role involves leading advanced packaging process integration and collaborating with various teams to ensure manufacturability and reliability of products.
ElectronicsManufacturingSemiconductorSoftware
Responsibilities
Process Integration & Development: Define, develop, and optimize advanced packaging process flows (e.g., TSV, RDL, bump, hybrid bonding, die stacking)
Cross-Functional Collaboration: Lead technical projects to integrate packaging needs into product designs, ensuring Design for Manufacturability (DFM) and Design for Reliability (DFR)
Design of Experiments (DOE): Plan and execute wafer-level and package-level experiments to optimize unit processes (dielectric deposition, plating, etching, CMP, bonding)
Yield & Failure Analysis: Analyze electrical, physical, and defect data to root-cause yield limiters and implement corrective actions
Vendor Management: Collaborate with OSATs and substrate manufacturers to define equipment/material roadmaps, track NPI (New Product Introduction), and ensure ramp-up readiness
Technical Leadership: Proactively identify and mitigate risks related to silicon-to-package interaction (SPI), warpage, and thermal management
Qualification
Required
Define, develop, and optimize advanced packaging process flows (e.g., TSV, RDL, bump, hybrid bonding, die stacking)
Lead technical projects to integrate packaging needs into product designs, ensuring Design for Manufacturability (DFM) and Design for Reliability (DFR)
Plan and execute wafer-level and package-level experiments to optimize unit processes (dielectric deposition, plating, etching, CMP, bonding)
Analyze electrical, physical, and defect data to root-cause yield limiters and implement corrective actions
Collaborate with OSATs and substrate manufacturers to define equipment/material roadmaps, track NPI (New Product Introduction), and ensure ramp-up readiness
Proactively identify and mitigate risks related to silicon-to-package interaction (SPI), warpage, and thermal management
Provide solutions that are highly creative, and directly contribute to product differentiation
Establish integration flow with manufacturability and reliability
Work closely with fab, assembly, substrate, connector partners, and collaborate with multi-functional teams within Applied and external partners
Team up with Design & Engineering modules (design, process, packaging, metrology teams) to deliver successful products
Team up with Product Marketing to understand the Product Marketing plans, and Product Roadmap
Benefits
Comprehensive benefits package
Participation in a bonus and a stock award program
Company
Applied Materials
Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.
Founded in 1967
10001+ employees
H1B Sponsorship
Applied Materials has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)
Funding
Current Stage
Public CompanyTotal Funding
$2.1BKey Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M
Leadership Team
Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
Tony Chiang, Ph.D
VP, CTO Applied AI
Recent News
2026-01-23
2026-01-23
2026-01-22
Company data provided by crunchbase