IBM · 19 hours ago
Entry Level Hardware and Systems Engineer
Hopewell Junction, NY
Full-time
Onsite
New Grad, Entry LevelIBM is a leading technology company, and they are seeking an Entry Level Hardware and Systems Engineer to support the development and qualification of packaging materials for advanced semiconductor packaging. This hands-on role involves collaborating with cross-functional teams and executing lab experiments to ensure the performance of semiconductor packaging technologies.
Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
Responsibilities
Supporting materials and process development for semiconductor packaging technologies (e.g., underfill, die attach, encapsulation, substrates)
Executing hands-on lab experiments, process trials, and development builds
Leading materials characterization and analysis to evaluate thermal, mechanical, and chemical performance
Assisting with failure analysis and root cause investigations related to packaging materials and processes
Collecting, analyzing, and documenting experimental data; preparing technical summaries and reports
Collaborating with cross-functional teams including packaging design, mechanical engineering, reliability, and manufacturing
Supporting technology qualification, readiness, and transfer to manufacturing
Qualification
Required
BS Materials, or Chemical Engineering, or a related field
Experience with design of experiments (DOE) and/or project management
Experience or strong interest in process development, materials development
Hands-on experience with hardware design or modeling/simulation environments
Strong analytical and communication skills, with a focus on collaboration and data-driven problem solving
Preferred
Master's Degree
M.S. or PhD in Materials, or Chemical Engineering, or a related field
Lab-based development or validation work skills
Experience leading project teams or cross-functional technical initiatives
Background in advanced electronic materials, composites, metallurgy
Experience with stress strain behavior, thermal interface and heat transfer materials, materials characterization and process engineering
Proficiency with finite element modeling (FEM or FEA) tools
Proficiency in one or more programming or scripting languages (Python, C/C++, Bash)
Company
IBM
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
Founded in 1911
10001+ employees
H1B Sponsorship
IBM has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)
Funding
Current Stage
Public CompanyTotal Funding
unknown2011-01-14IPO
Leadership Team
Alain Bénichou
Chief Executive Officer, IBM Greater China Group
Alex Yang
CTO and Chief Architect
Recent News
2026-01-25
2026-01-24
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