AMD · 12 hours ago
PCB Fabrication Process Engineer
AMD is a company dedicated to building innovative products that enhance next-generation computing experiences. They are seeking a Lead PCB Fabrication Process Engineer responsible for driving PCB performance, quality, and reliability specifications while collaborating with various teams to ensure best-in-class performance and reliability of PCB designs.
AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
Responsibilities
Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs
Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds
Own the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
Define technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability
Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level
Contribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp
Drive process improvements while executing fast time-to-market product delivery
Function decisively in a dynamic & fast-paced product development environment
Qualification
Required
Strong background & solid understanding of complex fabrication processes
High performance electronics hardware
Technical expertise in assembly reliability test/failure analyses
Effective communication skills
Collaborative mindset
Detail-orientation
Innovative critical problem solving/troubleshooting
Organized data collection
Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)
Preferred
Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
Expertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development
Excellent verbal & written communication skills at engineering and executive levels
Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
PCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America
Master's degree in Electrical/Electronics & Computer Engineering
Benefits
AMD benefits at a glance.
Company
AMD
Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.
Funding
Current Stage
Public CompanyTotal Funding
unknownKey Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
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