Summer 2026 AI Engineering Internship jobs in United States
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T-Mobile · 5 hours ago

Summer 2026 AI Engineering Internship

positionFrisco, TX
timeInternship
remoteOnsite
seniorityIntern
money$20/hr - $40/hr
workcardStart in 2026 Summer

T-Mobile is a leader in innovation within the wireless industry, offering a paid internship opportunity for aspiring AI engineers. Interns will gain hands-on experience by developing AI solutions that address real business problems, while collaborating with mentors and other team members.

InternetMobileTelecommunicationsWireless
badNo H1Bnote

Responsibilities

Developing Voice-based real-time AI Agentic Solutions
LLM Model Evaluation
Agentic observability
Exposure to the latest technology in the AI agentic framework
Hands-on Software development of Agentic Solution
Develop agentic solutions and
Involved in the software development process of scaling prototype solutions to enterprise solutions

Qualification

PythonTransformers / LLMsAPI Development (REST)Software Engineering FundamentalsTypescriptGoEmbeddings / Vector DatabasesDockerCloud Fundamentals

Required

Familiarity with one of the languages & frameworks (Python, Typescript, Go)
Understanding of Transformers / LLMs
Embeddings / Vector Databases
API Development (REST)
Software Engineering Fundamentals (data structures, OOP)
Docker / Cloud Fundamentals
At least 18 years of age
Legally authorized to work in the United States
High School Diploma or GED
Candidates must be currently enrolled in a degree program and have at least one semester remaining following the internship

Benefits

Relocation may be provided to program participants who reside more than 50 miles from the internship location.

Company

T-Mobile

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T-Mobile is a telecommunications company that provides wireless communication services, including mobile phone and internet services. It is a sub-organization of Deutsche Telekom.
dateFounded in 1994
location
Bellevue, Washington, USA
people-size10001+ employees
web-link
https://www.t-mobile.com

Funding

Current Stage
Public Company
Total Funding
$17.37B
2026-01-05Post Ipo Debt· $2B
2025-10-06Post Ipo Debt· $2.8B
2024-09-23Post Ipo Debt· $2.5B

Leadership Team

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John Saw
President of Technology, Chief Technology Officer
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Peter Osvaldik
EVP & CFO
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Recent News

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Company data provided by crunchbase