Teradar · 19 hours ago
Lead IC Packaging Engineer
San Jose, CA
Full-time
Onsite
Lead/Staff
10+ years expTeradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high resolution imaging in any weather condition. They are seeking a Lead IC Packaging Engineer to lead the development of advanced multi-chip packaging solutions for automotive-grade systems. This role involves technical leadership in IC package design, collaboration with engineers, and driving material selection and reliability qualifications.
AnimationSemiconductorSensor
Hiring Manager
Ben Hall
Responsibilities
Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration
Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions
Work on single-sided and double-sided RDL designs and on-package RF antenna structures
Co-optimize package designs for signal integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers
Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q)
Perform stress, warpage, and thermal simulations using tools such as ANSYS
Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development
Create and review mechanical drawings, stack-ups, and layout constraints
Lead failure analysis and root cause investigations for packaging and reliability issues
Contribute to the packaging roadmap and scalability plan for automotive volume production
Qualification
Required
10+ years of experience in IC packaging design and development, including leadership responsibilities
Proven track record with multi-chip packages, digital + RF integration, and automotive applications
Deep knowledge of UCIe interconnects, interposers, and advanced packaging architectures
Experience with RF antenna integration in package designs
Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions
Strong understanding of signal integrity, mechanical stress, thermal management, and reliability analysis
Established network with packaging vendors and OSATs
Education: M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
Excellent communication skills and ability to thrive in a fast-paced start-up environment
Benefits
Competitive compensation
Significant stock option package
Company
Teradar
TeraDAR offers 4D imaging sensors using Terahertz technology for high-resolution imaging in any weather.
51-200 employees
H1B Sponsorship
Teradar has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (1)
Funding
Current Stage
Growth StageTotal Funding
$174.6MKey Investors
VXI CapitalEngine Ventures
2025-11-12Series B· $150M
2023-01-01Series A· $22M
2022-01-01Seed· $2.6M
Leadership Team
Matthew Carey
CEO
Gregory Charvat
CTO & Co-Founder
Recent News
Tech Startups - Tech News, Tech Trends & Startup Funding
2026-01-06
2026-01-05
Company data provided by crunchbase