Foxconn Interconnect Technology (FIT) · 14 hours ago
Technical Project Manager
Foxconn Interconnect Technology (FIT) is focused on the development and marketing of electronic components and systems. They are seeking a senior wireless charging expert to lead system architecture and project execution for wireless charging technologies across various applications. The role requires deep expertise in hardware and firmware, along with technical leadership to drive products from concept to mass production.
Responsibilities
Lead MR / MI system architecture (Tx/Rx, power, RF, EMC, thermal, firmware)
Define system-level tradeoffs: efficiency, thermal, EMI, performance, cost, reliability
Mentor HW/FW teams and review designs
Serve as chief technical decision-maker on complex system challenges
MR (100 kHz–MHz, long-distance, high-power) and MI (Qi/WPC) for consumer/mobile
Resonance tuning, Q factor, coupling coefficient, coil design, L/C matching
Multi-coil, relay/repeater designs; FOD, efficiency, and thermal optimization
Inverter, DC-DC, AC-DC/DC-AC power design
EMI/EMC mitigation, shielding, ferrite use, thermal design
PCB schematic/layout review; RF, NFC, and automotive power systems (12V/24V/48V)
MCU architecture (ARM Cortex-M), PWM/Timer/ADC control
Closed-loop control (power, temperature, FOD)
Qi protocol stack, inverter/DC converter control, OCP/OVP protection
Firmware architecture, version control, workflow support
Automotive-grade system design; CCC Digital Key/NFC integration
Standards: ISO 7637/11452, CISPR 25, ISO 26262, ISO 21434
Software/system integration: AUTOSAR, CAN/LIN, UDS, OTA/Bootloader
IATF 16949, ASPICE, V-Model, ALM practices
Ansys HFSS/Maxwell, COMSOL, Keysight ADS
EMC validation, CANoe debugging & system modeling
Qualification
Required
Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or a related field
3-4 years of experience in engineering project management, with a focus on hardware implementation (preferred experience in Aerospace or Automotive industries)
Strong technical problem-solving skills and a proven track record of addressing complex hardware challenges
Ability to thrive in a fast-paced, dynamic environment while managing multiple stakeholders and maintaining excellent customer relations
Willingness to travel 25%-30% for on-site installations and collaboration with engineering teams at different locations
A hands-on mindset, with demonstrated experience in troubleshooting and hardware implementation, and the willingness to remain actively engaged in hands-on tasks
Benefits
Competitive compensation
World class benefits
Incentive and recognition programs
Company
Foxconn Interconnect Technology (FIT)
FIT is an innovative market leader of connectivity technologies within the data center, mobile, computing, and IoT environments.
Funding
Current Stage
Late StageRecent News
IEEE Spectrum
2025-12-29
Business Standard India
2025-10-25
Company data provided by crunchbase