GPD Optoelectronics Corp. · 12 hours ago
Lead Optical Packaging Engineer
Salem, NH
Full-time
Onsite
Lead/Staff
8+ years expGPD Optoelectronics Corp. is seeking an accomplished technical lead engineer with a diverse skill set to join their team. As the Lead Optical Packaging Engineer, you will oversee developing advanced packaging solutions, working closely with various engineering and operations teams to ensure product reliability and manufacturability.
Electronic Design Automation (EDA)ElectronicsManufacturingTelecommunications
Responsibilities
Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture
Develop and document manufacturing techniques, materials, tools and processes related to backend Photodiode assembly
Performs analyses and selects techniques to solve problems and enhance product yield and process flows
Establish high yielding, cost effective processes based on product need and customer requirements
Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis
Evaluates and validates process and design alternatives based on product manufacturability
Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing
Provides processes that are robust and repeatable against product specifications and that support the quoted cost
Lead the design and manufacturing team in the direction for improving and streamlining existing processes for increased package assembly quality and reduced assembly time
Mentor junior staff
Other duties as assigned by your manager
Qualification
Required
BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging
Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wirebonding, flip chip die attach, seam seal, laser mark, and related qualification techniques
Demonstrated experience of working with diverse engineering disciplines
Strong manufacturing experience which insures high yield along with controlled process
Preferred
MSME with 6+ years of direct semiconductor or photonics die packaging experience
5 years plus of technical leadership experience in crossfunctional teams
Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc
General awareness of FEAbased analysis techniques as related to photonics and PIC package designs would be distinct advantage
Company
GPD Optoelectronics Corp.
At GPD Optoelectronics, we're committed to upholding the highest standards of integrity and trust, which fuels our ongoing pursuit of excellence and fosters strong, lasting relationships with both our team members and customers.
51-200 employees
Funding
Current Stage
Growth StageLeadership Team
David Beatson
Chief Executive Officer
Don Belanger
Controller -report to Board Director, CEO.
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