Microsoft · 21 hours ago
Senior Thermal & Mechanical Engineer - Cryogenic ASIC Integration
Redmond, WA
Full-time
Onsite
Mid, Senior Level
$120K/yr - $235K/yr
6+ years expMicrosoft Quantum is a multidisciplinary team pioneering the development of scalable quantum computing technologies. They are seeking a Senior Thermal & Mechanical Engineer to focus on the design, simulation, and testing of thermal solutions for cryogenic CMOS integration and advanced packaging.
Agentic AIApplication Performance ManagementArtificial Intelligence (AI)Business DevelopmentDevOpsInformation ServicesInformation TechnologyManagement Information SystemsNetwork SecuritySoftware
No H1B
U.S. Citizen Only
Responsibilities
Drive thermal design and analysis for next-generation cryogenic CMOS systems, supporting the integration and packaging of quantum hardware modules
Model complex thermal loads and heat transfer mechanisms in the ultra-low temperature regime
Collaborate with cross-functional teams including cryomechanical engineers, quantum device designers, electrical engineers, packaging engineers, and systems architects to deliver holistic solutions for thermal management challenges
Design and execute experiments to validate thermal models and characterize system performance at cryogenic temperatures, including integration with custom test setups and data acquisition systems
Specify and evaluate materials and interface solutions that meet demanding requirements for low-temperature operation and mechanical integrity
Document findings, prepare technical reports, and communicate results to engineering and leadership teams
Qualification
Required
Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 1+ years related technical engineering experience in industry
OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 4+ years related technical engineering experience in industry
OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 6+ years related technical engineering experience in industry
OR equivalent experience
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role
These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations
The successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information
To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport
Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable
Preferred
Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 3+ years related technical engineering experience OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 6+ years related technical engineering experience OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 8+ years related technical engineering experience OR equivalent experience
4+ years of hands-on experience in solid-state thermal modeling, simulation, and testing, particularly in research and advanced product development settings
4+ years experience with thermal simulation software (such as ANSYS, COMSOL Multiphysics, SolidWorks Simulation or equivalent)
4+ years experience with cryogenic ASIC integration and packaging
Proficient with quantum hardware platforms and requirements for solid-state quantum systems
4+ years experience with cryogenic hardware platforms, such as cryostats and dilution refrigerators, emphasizing solid-state thermal conduction
Ability to lead experimental design, instrumentation, and analysis for thermal measurements in solids at ultra-low temperatures
Proficient communication and documentation skills, with a track record of technical leadership
Committed to mentor junior engineers and collaborate effectively across interdisciplinary teams
Proficient understanding of conduction and solid-state heat transfer physics at cryogenic temperatures
Proven ability to lead experimental design, instrumentation, and analysis for thermal
Company
Microsoft
Microsoft is a software corporation that develops, manufactures, licenses, supports, and sells a range of software products and services.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$1MKey Investors
Technology Venture Investors
2022-12-09Post Ipo Equity
1986-03-13IPO
1981-09-01Series Unknown· $1M
Leadership Team
Satya Nadella
Chairman and CEO
Vukani Mngxati
Chief Executive Officer - Microsft South Africa
Recent News
2026-01-16
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2026-01-16
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