Qualcomm · 2 hours ago
Staff Hardware Engineer (Austin OR San Diego)
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
$135K/yr - $202K/yr
4+ years expQualcomm Technologies, Inc. is a leading technology innovator focused on enabling next-generation experiences. They are seeking a Staff Hardware Engineer to design and develop motherboards and components for AI System On Chip solutions, collaborating with cross-functional teams to execute projects from concept to production.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Develops basic features and components of hardware designs in line with product proposals or roadmaps, under the supervision of more experienced engineers
Applies basic design rules and processes for electronic hardware, equipment, and/or integrated circuitry with minimal supervision from more experienced engineers
Reads device specification sheets and interprets basic details required to design various hardware features with minimal guidance from more experienced engineers
Evaluates devices and documents performance over various operating conditions and configurations
Assists in the assessment of common design features to identify potential flaws (e.g., electrical, mechanical, hardware), compatibility issues, and/or compliance issues under the supervision of more experienced engineers
Documents basic details about materials, components, chipsets, and assemblies for a device, and records important changes to design with minimal supervision from more experienced engineers
Troubleshoots basic issues with product designs
Provides reasonable schedule for own tasks to project lead
Develops understanding of Qualcomm products
Work with ODM on joint design, address technical issues and support mass production
Seeks basic knowledge of industry trends, competitor products, and advances in various engineering fields from publicly available information; requires minimal consultation with more experienced engineers to understand and apply advanced concepts
Qualification
Required
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience
OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience
OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience
System/card/rack-level development, including architecture, design, validation, and deployment of enterprise-class hardware platforms
Proven experience in rack-level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules
Familiarity with rack-scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards
Experience with rack-level diagnostics and bring-up, including debug of interconnects, signal integrity across long traces/cables, and system-level validation
Understanding of rack-level mechanical constraints, EMI shielding, and compliance with data center deployment standards
Collaboration with ODMs/OEMs on rack-level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing
Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery
Expertise in chassis design, airflow optimization, and thermal management
Solid understanding of system software operation from bootloader to OS and application layers
Experience qualifying PMICs, voltage regulators (VRs), clock buffers, flash memory, and connectors for use in complex card and rack-level designs
Hands-on experience in dense, high-layer count PCB designs (8–20+ layers)
Skilled in PCIe add-in card/module design, debugging in high-performance systems (x86 and ARM)
Familiarity with JTAG tools for bring-up and debug
Experience with networking switches and high speed ethernet interfaces
Knowledge of high-speed serial I/O (6–10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE
Experience with long PCB/cable topologies (0.35–1.5 meter), signal integrity, and compliance with current standards
Ability to debug at packet/protocol level across link, transport, transaction, and command layers
Experience with LPDDR4x memory technologies, DIMM layout and validation
Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration
Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition)
Experience with circuit simulation tools (SPICE), signal/power integrity analysis
Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers
Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines
Good understanding of x86 FW/SW stack and firmware architecture
Experience with BMC hardware/software integration and management
Familiarity with regulatory, environmental, and compliance testing for rack-level systems
Preferred
Master's Degree in Electrical and Electronic Engineering, Computer Engineering, or related field
5+ years hardware engineering/Systems development experience or related work experience
5+ years of experience with circuit design (e.g., digital, analog, RF)
5+ years of experience utilizing schematic capture and circuit simulation software
5+ years of experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, debug tools, etc
Benefits
Competitive annual discretionary bonus program
Annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
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