Printed Circuit Board (PCB) Layout Engineer jobs in United States
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Hewlett Packard Enterprise · 3 hours ago

Printed Circuit Board (PCB) Layout Engineer

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. They are seeking an experienced Printed Circuit Board (PCB) Layout Engineer to design complex PCBs for high-performance computing systems, working independently to layout and help release high-speed PCBs into production.

Data CenterEnterprise SoftwareInformation TechnologyIT ManagementNetwork Security
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H1B Sponsor Likelynote

Responsibilities

Designs Printed Circuit Board layouts using computer aided design software, consistent with electrical engineering circuit performance, signal integrity, and EMI specifications, mechanical engineering form factor and thermal requirements, and manufacturing requirements
Reads/interprets schematics, system functionality and performance specifications, and the company PCB design guidelines as necessary to complete printed circuit board layouts
Determines PCB design approaches and parameters
Influences design decisions related to the analysis and resolution of system performance issues related to the printed circuit board layout

Qualification

Cadence Allegro PCB EditorHigh speed PCB designPCB Design GuidelinesDDR4+ layout experienceHigh speed routing techniquesDesign for Manufacturing (DfM)Design for Test (DfT)Analytical ThinkingCommunication skillsCross-Functional Teamwork

Required

Associates degree or equivalent technical degree
10 or more years' experience laying out complex, multi-layered, high speed printed circuit boards
Advanced knowledge in the use of ECAD software, particularly experience with Cadence Allegro PCB Editor required
Advanced knowledge of PCB Design Guidelines and design constraints
Have performed layout studies and placement and helped drive sound architectural decisions
Have experience laying out boards with DDR4+, PCIe Gen 4+, high speed SerDes, Ethernet, I2C, SPI, etc
Experience in high speed routing techniques such as microvias, blind and buried vias, backdrilling, etc
Experience working with PCB fabrication shops and PCA contact manufacturers
Ability to read and interpret schematics, datasheets, layout guidelines
Ability to work with and if necessary drive, engagements with design partners such electrical engineers, mechanical engineers, signal integrity and power integrity engineers, etc
Working knowledge of electronics including signal and power integrity issues
Understanding of EMC principals and best practices to mitigate EMI
In depth knowledge of Design for Manufacturing (DfM) and Design for Test (DfT) principals
Ability to work independently with loosely defined parameters and perform conceptual analysis
Ability to work successfully with engineers across various geos to meet design requirements and schedules
Ability to manage multiple board designs at a time
Excellent written and verbal communication skills

Preferred

Experience with liquid cooled designs is a plus
Experience helping define ASIC package ball maps is a plus
Experience with industry standard form factors such as PCIe CEM and Open Compute Project is a plus
Experience creating symbols and managing symbol libraries is a plus

Benefits

Health & Wellbeing
Personal & Professional Development

Company

Hewlett Packard Enterprise

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Hewlett Packard Enterprise is an edge-to-cloud company that uses comprehensive solutions to accelerate business outcomes.

H1B Sponsorship

Hewlett Packard Enterprise has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (532)
2024 (585)
2023 (591)
2022 (523)
2021 (551)
2020 (398)

Funding

Current Stage
Public Company
Total Funding
$2.85B
Key Investors
Elliott Management Corp.
2025-04-15Post Ipo Equity· $1.5B
2024-09-10Post Ipo Equity· $1.35B
2015-11-02IPO

Leadership Team

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Antonio Neri
President & CEO
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Fidelma Russo
EVP & GM, Hybrid Cloud and Chief Technology Officer
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Company data provided by crunchbase