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Google · 1 day ago

Advanced Packaging Development Engineer, Quantum AI

Goleta, CA, USA

Full-time

Onsite

Mid Level

$147K/yr - $216K/yr

3+ years exp

Google is seeking an Advanced Packaging Engineer to contribute to the research and development of next-generation packaging platforms for superconducting quantum processors. The role involves pioneering packaging methods and collaborating with various teams to transition research concepts into deployable solutions.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO

Growth Opportunities

H1B Sponsor Likely

Responsibilities

Design and architect novel packaging platforms

Conduct Root Cause analysis and develop mitigation strategies for performance limiting factors (e.g., yield, reliability, signal loss) unique to those new technologies

Lead technical engagements with external vendors and partners to evaluate, co-develop, and qualify next generation packaging processes and components outside of the current standard manufacturing processes

Develop and document new process flows and Design-For-Integration (DfI) principles for emerging technologies

Investigate and characterize electrical, thermal, and mechanical properties of advanced packaging materials

Qualification

Advanced packaging solutions2.5D/3D integrationWafer-level packagingSimulation toolsSemiconductor packagingQuantum computing hardwareElectrical EngineeringComputer EngineeringComputer SciencePhysicsOpticsSensorsAudio/DSP

Required

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience

3 years of experience developing advanced packaging solutions

3 years of experience delivering research and development (R&D) concepts to a released product

3 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer-level packaging, panel-level packaging, or hybrid bonding

Preferred

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP)

Experience using simulation tools to evaluate electrical/RF, thermal, or mechanical performance of packaging structures and guide new designs

Experience in a semiconductor packaging environment

Familiarity with quantum computing hardware architectures and the specific constraints they impose on packaging design

Benefits

Bonus

Equity

Benefits

Company

Google

Glassdoor4.4

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

Founded in 1998

Mountain View, California, USA

10001+ employees

https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (8763)

2024 (8872)

2023 (9682)

2022 (11626)

2021 (9109)

2020 (9785)

Funding

Current Stage

Public Company

Total Funding

$26.1M

Key Investors

Andy Bechtolsheim

2004-08-19IPO

1999-06-07Series Unknown· $25M

1998-11-01Angel· $1M

Leadership Team

Sundar Pichai

CEO

Thomas Kurian

CEO - Google Cloud

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