Marvell Technology · 17 hours ago
Principal Package Engineer
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$137K/yr - $205K/yr
7+ years expMarvell Technology is a leader in semiconductor solutions that power the data infrastructure connecting our world. The Principal Package Engineer will drive semiconductor package development from concept to mass production, focusing on New Product Introduction (NPI) and collaborating with cross-functional teams to define optimal package solutions.
DSPInternet of ThingsManufacturingSemiconductorWireless
No H1B
U.S. Citizen Only
Responsibilities
Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product
Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability
Perform package design review
Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual
Provide inputs to design guidelines and drive to implement the guidelines
Achieve milestone dates for all NPI schedules
Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues
Work with procurement and suppliers on package cost analysis
Provide inputs to the package technology roadmap
Support new package and technology development
Manage and mentor junior engineers if required
Qualification
Required
Bachelor's degree in ME and Material science or related fields and 10+ years of professional experience in the semiconductor packaging field OR Master's degree and/or PhD in ME and Material science or related fields and 7+ years of professional experience in the semiconductor packaging field
Experience in substrate, RDL and assembly
Experienced with flip-chip package development and substrate review
Basic Cadence APD and AutoCAD skills
Deep understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques
The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging
Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers
Good program management skills
Ability to work independently, provide leadership and to exercise discretion to solve complex problems
Preferred
OSAT management experience is a plus
Manager experience is a plus
Benefits
Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
Recent News
2026-01-12
2026-01-11
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