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Hardware Design Engineer jobs in United States
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Rambus · 9 hours ago

Hardware Design Engineer

Rambus is a premier chip and silicon IP provider making data faster and safer, and they are seeking a Hardware Design Engineer to join their MCG team in Hillsboro. In this role, you will work with top inventors and engineers to develop products that enhance data speed and security.
ArchitectureLightingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Design architecting and trade-off analysis
RTL coding and verification
Memory Controller + PHY integration and verification
Customer delivery and support

Qualification

System Verilog/Verilog RTLASIC/FPGA designQuesta/Incisive/VCS simulatorPython/Perl/Tcl scriptingASIC synthesis experienceMemory expertiseAMBA AXI/CHI designCommunication skillsProject management skills

Required

Strong System Verilog/Verilog RTL design expertise
Questa/Incisive/VCS simulator experience
Python/Perl/Tcl scripting experience
Significant ASIC and/or FPGA design experience
Ability to learn quickly and work independently
Solid communication and project management skills
5+ years of logic design experience
BSEE

Preferred

ASIC synthesis, timing constraint, CDC/RDC experience
Verification experience
Memory (HBM, GDDR, LPDDR, DDR) expertise
AMBA AXI or CHI design experience
Located in the Hillsboro, Oregon area

Benefits

Competitive compensation package
Bonus
Equity
Matching 401(k)
Employee stock purchase plan
Comprehensive medical and dental benefits
Time-off program
Gym membership

Company

Rambus designs, develops and licenses chip interface technologies and architectures that are used in digital electronics products.

H1B Sponsorship

Rambus has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (25)
2024 (16)
2023 (7)
2022 (8)
2021 (3)
2020 (11)

Funding

Current Stage
Public Company
Total Funding
$288.57M
2023-07-20Acquired
2011-06-07Post Ipo Equity· $88.57M
2010-02-02Post Ipo Equity· $200M

Leadership Team

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Luc Seraphin
CEO
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Sean Fan
Chief Operating Officer
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Company data provided by crunchbase