Summer Intern - Hardware Engineering jobs in United States
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HARMAN International · 1 hour ago

Summer Intern - Hardware Engineering

HARMAN International is a technology leader focused on innovation and teamwork. They are seeking a Hardware Engineering Summer Intern to contribute to the design and development of new display-based hardware, including circuit design and hardware debugging.

AudioConsumerConsumer ElectronicsDSPElectronicsManufacturing
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Responsibilities

Act as a valued junior HW engineer on the team
Continuously partner with colleagues in other developmental teams, e.g. mechanical, software, and systems engineering
Support the team in the creation of display and projection technology

Qualification

Analog circuit designDigital circuit designCircuit simulationSchematic designCircuit debuggingEmbedded software knowledgeFPGA designOptical engineeringPrior HW engineering intern experience

Required

A thorough understanding of analog and digital circuit design
Proficiency with circuit simulation, schematic design, layout design, and circuit debugging
Must be currently enrolled in a Bachelor's Degree program at an accredited institution having completed your Sophomore year or later, taking at least one class in the semester/quarter before participation in the internship program, and returning to school for at least one semester upon completion of the internship program
Must have a cumulative 3.0 GPA
Be willing to work in an office in Novi, Michigan
Able to provide your own housing and transportation to/from work
Must possess unrestricted work authorization
Successfully complete a background investigation and drug screen as a condition of employment
Must provide full work availability from May 18, 2026 through August 7, 2026 and be able to work 40 hours per week

Preferred

Embedded software knowledge
FPGA design with understanding of VHDL or VERILOG
Understanding of optical engineering
Prior HW engineering intern experience

Benefits

Paid sick leave
Medical benefits

Company

HARMAN International

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Headquartered in Stamford, Connecticut, HARMAN (harman.com) designs and engineers connected products and solutions for automakers, consumers, and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation solutions; and services supporting the Internet of Things.

Funding

Current Stage
Public Company
Total Funding
unknown
2016-11-14Acquired
1986-11-21IPO

Leadership Team

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Darrin Shewchuk
Vice President, Public Affairs and Communications
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Christian Sobottka
President and Chief Executive Officer at HARMAN International
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Company data provided by crunchbase