HARMAN International · 1 hour ago
Summer Intern - Hardware Engineering
HARMAN International is a technology leader focused on innovation and teamwork. They are seeking a Hardware Engineering Summer Intern to contribute to the design and development of new display-based hardware, including circuit design and hardware debugging.
AudioConsumerConsumer ElectronicsDSPElectronicsManufacturing
Responsibilities
Act as a valued junior HW engineer on the team
Continuously partner with colleagues in other developmental teams, e.g. mechanical, software, and systems engineering
Support the team in the creation of display and projection technology
Qualification
Required
A thorough understanding of analog and digital circuit design
Proficiency with circuit simulation, schematic design, layout design, and circuit debugging
Must be currently enrolled in a Bachelor's Degree program at an accredited institution having completed your Sophomore year or later, taking at least one class in the semester/quarter before participation in the internship program, and returning to school for at least one semester upon completion of the internship program
Must have a cumulative 3.0 GPA
Be willing to work in an office in Novi, Michigan
Able to provide your own housing and transportation to/from work
Must possess unrestricted work authorization
Successfully complete a background investigation and drug screen as a condition of employment
Must provide full work availability from May 18, 2026 through August 7, 2026 and be able to work 40 hours per week
Preferred
Embedded software knowledge
FPGA design with understanding of VHDL or VERILOG
Understanding of optical engineering
Prior HW engineering intern experience
Benefits
Paid sick leave
Medical benefits
Company
HARMAN International
Headquartered in Stamford, Connecticut, HARMAN (harman.com) designs and engineers connected products and solutions for automakers, consumers, and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation solutions; and services supporting the Internet of Things.
Funding
Current Stage
Public CompanyTotal Funding
unknown2016-11-14Acquired
1986-11-21IPO
Leadership Team
Recent News
2026-01-18
2026-01-16
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