USAJOBS · 1 day ago
Microelectronics Engineer - Mid to Experienced Level (Maryland)
Fort Meade, Maryland, USA
Full-time
Onsite
Mid, Senior Level
$105K/yr - $193K/yr
3+ years expUSAJOBS is seeking Microelectronics Engineers to join the National Security Agency (NSA) team. The role involves designing, assembling, testing, and qualifying the next generation of electronics hardware to support the agency's mission.
ConsultingGovernmentHuman ResourcesInformation TechnologyInternetStaffing Agency
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission
Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission
The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer
A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures
Areas of responsibility can also include: Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis Understanding and development of assembly specifications in accordance with industry standards Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design Conduct research including studies, experiments, and investigations on new or alternate methodologies Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics
A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures
Areas of responsibility can also include: Participate in assembly and fabrication process improvement efforts Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics
A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures
Areas of responsibility can also include: Conduct environmental and reliability tests High-pin-count Integrated Circuit (IC) design and operation validation Parametric testing - Accelerated testing / qualification / screening Develop test plans according to industry and military specifications Design and develop test platforms Support quality assurance efforts for developed and fielded systems Disassembly and sample preparation for physical analysis of ICs for failure analysis Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)
Qualification
Required
The degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)
If program is not ABET EAC accredited, it must include specified coursework
Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics
Relevant experience must be in one or more of the following: developing advanced microelectronics systems through the design of integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures using electronic design automation (EDA) tools
With a degree in Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience
With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered
Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures
Entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered
Relevant experience must be in one or more of the following: characterization, test, reliability, or failure root cause analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures
Entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered
Benefits
NSA offers a comprehensive benefits package.
A career with the U.S. government provides employees with a comprehensive benefits package.
Company
USAJOBS
USAJOBS enables federal job seekers to access job opportunities across hundreds of federal agencies and organizations.
10001+ employees
Funding
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