Teradyne · 11 hours ago
NPI DFM Process Development Engineer (Teradyne, No Reading, MA, Agoura Hills, CA or Deer Park, IL)
Teradyne is a global test and automation specialist that powers next-generation technologies through sophisticated solutions. They are seeking a Process Engineer to engage in Printed Circuit Board development, using DFM principles to influence product designs and support new assembly processes.
Consumer ElectronicsIndustrialIndustrial Automation
Responsibilities
Collaborate with Hardware Design on New Product initiatives, influencing Printed Circuit Board Assembly product development with Design for Manufacturability principles
Drive failure analysis for electrical components and PCBA solder defects
Develop and support Teradyne PCBA Design for Manufacturability guidelines and assembly best practices; drive improvements and updates to NPI process documentation
Support Operations NPI objectives by executing component assessment, manufacturing process development, and fault-down activities for printed circuit board assemblies
Work with contract manufacturing teams to support new PCBA initial builds, experiments, and failure analysis
Lead NPI Lessons Learned activities, integrating feedback from high-volume manufacturing into NPI processes
Qualification
Required
Bachelor's Degree in Engineering (Manufacturing, Mechanical preferred)
5+ years in printed circuit board assembly and manufacturing
Knowledge of PCBA processes (solder paste printing, SMT placement, reflow soldering, aqueous cleaning, automated inspection, ESD principles)
Familiarity with IPC-610, IPC-7711/7721, J-STD
Experience with PC layout/design review software (Cadence Allegro, Valor); EMS/CM supplier collaboration desirable
Able to travel ~10%; periodic calls with Asian teams and suppliers
Benefits
Medical
Dental
Vision
Flexible Spending Accounts
Retirement savings plans
Life and disability insurance
Paid vacation & holidays
Tuition assistance programs
Company
Teradyne
Teradyne is a supplier of automatic test equipment used to test complex electronics used in consumer electronics.
Funding
Current Stage
Public CompanyTotal Funding
unknown1978-01-13IPO
Recent News
2026-01-16
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