Intel Corporation · 1 hour ago
Module Development Engineer- Hybrid Bonding
Hillsboro, OR
Full-time
Hybrid
New Grad, Entry Level
$99K/yr - $140K/yr
0+ years expIntel Corporation is a leader in semiconductor manufacturing, aiming to create world-changing technology that enriches lives. They are looking for a Module Development Engineer to drive equipment performance and product quality, ensuring safety and efficiency in manufacturing processes.
Semiconductors
Responsibilities
Owning execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required
Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability
Owning process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites
Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met
Improving safety, maintenance, and operational procedures for engineers and technicians
Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors
Owning New Product Introduction, leading integration of new technologies, ensuring seamless transitions
Owning development and optimization of excursion prevention systems for the equipment and process
During factory ramps, owning equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes)
Qualification
Required
MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field
Interested in fab process with database experience and analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C++, Python, MES
Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA)
Strong analytical and problem-solving skills
Excellent communication and teamwork abilities
Able to work onsite in Ronler Acres facilities in Hillsboro, OR
Eagerness to learn and adapt in a fast-paced environment
Preferred
Graduates with up to 2 years of relevant experience; prior experience in the semiconductor industry and a manufacturing environment will be considered an advantage
Benefits
Competitive pay
Stock
Bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
Recent News
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