Senior Manager – Photo-lithography jobs in United States
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Nokia · 6 hours ago

Senior Manager – Photo-lithography

Nokia is a leading company in the semiconductor industry, and they are seeking a Senior Manager for Photo-lithography. The role involves team leadership for photolithography process engineering, focusing on process development and qualification in both existing and new technology generations.

ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
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Culture & Values
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H1B Sponsor Likelynote

Responsibilities

Team leadership for photolithography process engineering
Focus areas include process sustaining for the 24x7 operation, development, qualification, and release of improved photo-lithography processes on both existing and new technology generations
Support the execution of a steep wafer volume and yield roadmap in the existing manufacturing wafer fab (Fab1)
Team leadership related to process qualification and implementation in a new fab focusing on larger wafer sizes (Fab2)
Participate in various cross functional teams as a technical content expert
Optimize coat, exposure and develop processes related to Indium Phosphide (InP) based Photonic Integrated Circuit (PIC) wafer fabrication
Develop and implement processes with improved process capability in both Fab1 and Fab2
Develop and deploy control plans to keep photo-lithography processes operating within performance parameters
Troubleshoot photo-lithography process problems and drive details of improvement project execution to enable a smooth flow of production and development wafers
Execute process development and lithography roadmap activities needed for future PIC technology
Participate in various cross functional teams consisting of equipment, process, and integration engineers to improve process capability, wafer yields, simplify procedures and processes, and release new tools and processes with improved capacity and capability
Maximize the opportunity to adopt semiconductor industry best practices for Fab2 including automation of wafer and reticle handling and releasing more modern manufacturing tools for PIC wafers with variable topography
Lead team members partnering with the PIC R&D team to enable the development and qualification of new processes required to deliver next generation high-performance multi-Tb PICs

Qualification

Photo-lithography expertiseSemiconductor fabrication knowledgeProcess development experienceJMPDOESPCLeadership skillsCommunication skills

Required

Team leadership for photolithography process engineering
Focus areas include process sustaining for the 24x7 operation, development, qualification, and release of improved photo-lithography processes on both existing and new technology generations
Support the execution of a steep wafer volume and yield roadmap in the existing manufacturing wafer fab (Fab1)
Team leadership related to process qualification and implementation in a new fab focusing on larger wafer sizes (Fab2)
Participate in various cross functional teams as a technical content expert
Optimize coat, exposure and develop processes related to Indium Phosphide (InP) based Photonic Integrated Circuit (PIC) wafer fabrication
Develop and implement processes with improved process capability in both Fab1 and Fab2
Develop and deploy control plans to keep photo-lithography processes operating within performance parameters
Troubleshoot photo-lithography process problems and drive details of improvement project execution to enable a smooth flow of production and development wafers
Execute process development and lithography roadmap activities needed for future PIC technology
Participate in various cross functional teams consisting of equipment, process, and integration engineers to improve process capability, wafer yields, simplify procedures and processes, and release new tools and processes with improved capacity and capability
Maximize the opportunity to adopt semiconductor industry best practices for Fab2 including automation of wafer and reticle handling and releasing more modern manufacturing tools for PIC wafers with variable topography
Lead team members partnering with the PIC R&D team to enable the development and qualification of new processes required to deliver next generation high-performance multi-Tb PICs
JMP, DOE, SPC
Working knowledge of semiconductor fabrication processes, and specific expertise in photo-lithography
Strong leadership and communication skills
Experience with semiconductor process development, sustaining, new process introduction, and ramp to volume
Experience supporting a 24x7 fab operations team, writing and training of fab procedures, root cause analysis and problem resolution
Education/Experience Required: BS with 5 years' experience, or MS with 3 years' experience

Company

Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.

H1B Sponsorship

Nokia has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)

Funding

Current Stage
Public Company
Total Funding
$4.45B
Key Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B

Leadership Team

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Justin Hotard
President and CEO
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Victoria Hanrahan
Chief of Staff to the CEO
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Company data provided by crunchbase