Qualcomm · 1 week ago
Staff Central Hardware Systems - Architecture and Design Engineer
San Diego, California, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$154K/yr - $231K/yr
7+ years expQualcomm Technologies, Inc. is looking for highly talented and innovative individuals to join their Central Hardware Systems Architecture and Design team. The role involves collaborating with cross-functional teams to create high-performance package/SIPs designs for XR products, ensuring successful transition to production.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
IC top level floorplanning and understanding of hard macro block placement, padring, RDL and bump pattern/assignment
System level co-design methodology of IC, Package and PCB/Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
Experience with ORCAD schematic and Allegro design tools
Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
Understanding on PMIC and its eBOM
Designing PDN from PMIC to SOC to meet the given targets
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Designing High speed interfaces
Verification for packages and sips using Valor and ravel checks
Design review with suppliers and Osats
Evaluations on optimizing cost and area for a given package/SIP structure
Qualification
Required
Master's degree in Electrical or Computer Engineering or a related field
7+ years of experience in package/SIP/PCB hardware design
Expertise designing high-speed, dense, multi-layer Packages, PCBs and systems
Proficiency in logic design, schematic capture, board layout tools, and testing
Strong knowledge of SIPI, PDN, thermal management, and compliance testing
Expertise in high-speed analog and digital design
Hands-on experience with PCIe, DDR, Ethernet, SerDes, and communication protocols (I2C/I3C/SPI/MDIO)
Proven ability to work independently and collaboratively within a cross-functional team environment
Strong technical documentation skills and excellent written and verbal communication
Preferred
PhD degree in Electrical or Computer Engineering or a related field
5+ years of experience in package/PCB design
In-depth knowledge of PMIC, RF front end, Memories
Working knowledge with scripting languages (Python, PERL, TCL)
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
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