SkyWater Technology · 5 hours ago
Engineering Intern
Austin, TX
Internship
Onsite
InternSkyWater Technology is a leader in semiconductor manufacturing, improving lives through innovative technologies. The Engineering Intern will gain hands-on experience in a wafer fabrication facility, working on various process improvement projects under the guidance of experienced professionals.
AerospaceManufacturingService Industry
Responsibilities
You will gain experience in a wafer fabrication facility within one of our Photolithography, Etch, Diffusion/Wet Clean, or Thin Film Deposition groups
Interns work on process improvement projects, equipment variability reduction, product yield improvement, process and product cost reduction, and capital equipment sourcing, tool installation and acceptance
Interns are paired with a mentor in their specific area to assign projects, and assist them in their completion
Interns will learn statistical process control, automated process control, statistical analysis of data and familiarity with the collaborative culture of SkyWater
Qualification
Required
Completion of Junior year + in a bachelor's degree program in chemical engineering, mechanical engineering, electronic engineering, materials science, chemistry or physics
Experience with statistics
Experience manipulating large data sets
Preference for working in small groups or teams
Ability to work on multiple projects at the same time
Company
SkyWater Technology
SkyWater Technology is a Semi-Conductor Manufacturer.
Founded in 2017
501-1000 employees
H1B Sponsorship
SkyWater Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (1)
2021 (1)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$345MKey Investors
U.S. Department of Defense
2024-11-25Post Ipo Debt· $30M
2023-01-04Post Ipo Debt· $130M
2022-07-28Grant· $15M
Leadership Team
John Sakamoto
President and COO
Bassel Haddad
SVP and GM, Advanced Packaging
Recent News
2026-01-07
2026-01-05
Company data provided by crunchbase