SkyWater Technology · 11 hours ago
Process Development Engineering Intern
Kissimmee, FL
Internship
Onsite
InternSkyWater Technology is a leading semiconductor manufacturer that focuses on innovative technologies to improve lives globally. The Process Development Engineering Intern will gain hands-on experience in semiconductor packaging processes while working alongside experienced professionals on various projects.
AerospaceManufacturingService Industry
No H1B
U.S. Citizen Only
Responsibilities
Support the efforts of Process Development Module Engineers to prepare for and execute new semiconductor packaging processes
Run experiments and generate Kerf maps of common substrates and thicknesses
Interpret CAD drawings from the customer and develop a methodology to set up dicing automation accordingly
Controlled test cuts will be performed on common substrate materials and thicknesses
Kerf will be measured precisely using standard methods and Kerf maps will be generated
The intern will also assist the dicing engineer in interpreting CAD files and setting up the Dicing tool automation accordingly
Understand the impact of key process input variables, and achieve tight thickness uniformity, control warpage, and prevent subsurface damage and cracks
Optimize throughput and quality during the backgrind and top grind process
Develop familiarity with consumable toolsets and process metrology tools such as Keyence microscopes
Evaluate the effect of process input variables such as: Device side topography, pre-grind warpage, grinding abrasive grit, bond type, dressing condition, dressing tape type, feed rate, downforce, coolant flow rate, on final thickness, TTV, WIWNU, mechanical grinding stresses, chipping, delamination, microcracking, post-grind warpage, and die cracking
The Intern will work with the process engineer to help overcome process issues
Key challenges to overcome in the high temperature TBDB process is to balance high temperature survivability while minimizing post bond residue, controlling wafer bow, and preventing die cracking and edge chipping
Assist with optimizing surface preparation variables (wafer cleanliness, flatness, pretreatment, etc.), coating variables (spin curves, edge bead removal, film thickness range), cure variables (Bake Temperature, Time) and Bonding variables (Bond Temperature, Pressure, vacuum level, time, etc.) to optimize Bond strength, debond yield, control wafer bow, particle adders, residues, and electrical parameters
Assist the engineer in optimizing compression process variables (mold temperature, ramp rate, compression force, ramp, pressure profiles, flow time, cure time), vacuum levels, and outgassing for a given mold compound and panel and package stack, mold tool and cavity
Control CTE mismatch between the substrate and the EMC to produce integrated die molds with excellent cosmetic and dimensional finish with minimal warpage, cracks, flashing, delamination and voids with acceptable throughput
Assist the Lithography engineering team in developing processes for patterning Dry Film Resists (using LDI)
Assist the Lithography engineering team in developing processes for the development of conventional liquid resist spin, bake and develop processes
Resist stripping processes are also in the scope of the duties. As well as resist measurement metrology using ellipsometry
Assist with CD SEM and Overlay measurement characterization and process window optimization
Work closely with the plating engineer to analyze and maintain the plating baths
Assist the engineer in the development of robust electroplating processes with good uniformity, fill characteristics, and low-stress films
If the scope and time permit, the intern will also develop superconformal electroless plating processes for high aspect ratio via fills
Qualification
Required
Completion of Junior year+ in a bachelor's degree program in the areas of Chemistry, Chemical Engineering, Materials Engineering, Polymer Engineering
US Citizenship Required
Preferred
Hands-on experience in setting up and running clean room experiments
Company
SkyWater Technology
SkyWater Technology is a Semi-Conductor Manufacturer.
Founded in 2017
501-1000 employees
Funding
Current Stage
Public CompanyTotal Funding
$345MKey Investors
U.S. Department of Defense
2024-11-25Post Ipo Debt· $30M
2023-01-04Post Ipo Debt· $130M
2022-07-28Grant· $15M
Leadership Team
John Sakamoto
President and COO
Bassel Haddad
SVP and GM, Advanced Packaging
Recent News
2026-01-07
2026-01-05
Company data provided by crunchbase