NPT Manufacturing Engineer IV - Etch (E4) jobs in United States
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Applied Materials · 5 hours ago

NPT Manufacturing Engineer IV - Etch (E4)

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. As an NPT Manufacturing Engineer, you will be responsible for ensuring manufacturing readiness for new products, leading pilot and early volume builds, and driving cross-functional alignment to achieve high-quality production outcomes.

ElectronicsManufacturingSemiconductorSoftware
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H1B Sponsor Likelynote

Responsibilities

Own Manufacturing Readiness: Define and sustain manufacturing processes, methods, and flows that enable reliable builds with high quality and repeatability
Lead Pilot and Early Volume Builds: Drive execution of Pilot and initial volume builds in partnership with NPT PMs, manufacturing, and quality, coordinating floor activity and prioritizing issues as conditions evolve
Apply Design for Excellence (DFx): Influence product and process decisions to improve customer satisfaction, reduce cost, simplify assembly, and increase ergonomics using data and experience to guide tradeoffs
Drive Cross-Functional Alignment: Work directly with Design Engineering, Volume Engineering, Quality, and Supply Chain to align on manufacturing requirements and execute readiness plans
Enable Product Maturity: Lead manufacturing changes that improve manufacturability, reliability, and scalability as products approach high-volume release
Own Issue Resolution: Serve as the technical point of accountability for real-time manufacturing build and test issues
Own Build Documentation Readiness: Ensure work instructions, process documentation, and manufacturing standards are accurate, usable, and sustained
Own Test Readiness: Partner with engineering teams to define test specifications, procedures, and acceptance criteria
Assess and Mitigate Risk: Identify manufacturing risks early through design reviews and readiness assessments, and drive mitigation before production is impacted
Lead on the Manufacturing Floor: Work side-by-side with technicians and assemblers during builds, assessing conditions as they emerge

Qualification

Manufacturing process developmentNew product transition (NPT)Design for ManufacturingPilot builds experienceSAPERP systemsTechnical leadershipMentoring engineersProblem-solvingCross-functional collaboration

Required

Strong background in manufacturing process development and new product transition (NPT)
Experience supporting Pilot and early volume builds in a complex manufacturing environment
Deep understanding of Design for Manufacturing, Assembly, and Test (DFx)
Proven ability to diagnose manufacturing build and test issues using data and structured problem-solving
Demonstrated technical leadership on the manufacturing floor, providing direction to technicians and cross-functional partners
Bachelor's degree in Mechanical, Manufacturing, Industrial Engineering, or a related technical field
Typically 7–10 years of relevant manufacturing or NPI experience

Preferred

Experience with SAP or similar ERP systems
Exposure to semiconductor capital equipment or complex system integration
Experience mentoring and developing less-experienced engineers

Benefits

Comprehensive benefits package
Participation in a bonus and a stock award program

Company

Applied Materials

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Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.

H1B Sponsorship

Applied Materials has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)

Funding

Current Stage
Public Company
Total Funding
$2.1B
Key Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M

Leadership Team

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Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
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Tony Chiang, Ph.D
VP, CTO Applied AI
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Company data provided by crunchbase