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Google · 20 hours ago

Package Design Engineer, Silicon

Mountain View, CA, USA

Full-time

Onsite

Entry, Mid Level

$132K/yr - $189K/yr

2+ years exp

Google is seeking a Package Design Engineer, Silicon to be part of a team that develops custom silicon solutions for their direct-to-consumer products. The role involves executing physical package substrate design for mobile SOC packages and collaborating with various engineering teams to optimize package architecture and design.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO

Growth Opportunities

H1B Sponsor Likely

Responsibilities

Execute physical package substrate design of mobile SOC packages as an individual contributor, meeting performance/power/area requirements

Perform Design Rule Check (DRC) and Layout Versus Schematic (LVS) verification of package designs

Participate in the development of new silicon IPs and packaging technology through feasibility studies and package test vehicle designs

Collaborate closely with Signal Integrity (SI)/Power Integrity (PI), Test, NPI and Mechanical Engineering teams to refine and optimize product package architecture and design

Interface with packaging suppliers, ensuring package design and Bill of Materials (BOM) documentation meets requirements for high volume manufacturing

Qualification

Chip package substrate designCadence APDMobile SOC package designPackage routing strategyPhysical verification flowElectromagnetic fundamentalsMechanical drawings

Required

Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience

2 years of experience in chip package substrate design using cadence APD (Allegro Package Designer) or mentor expedition

Experience in chip package substrate layout, design rules/verification, DFM and taping out for production

Experience in mobile SOC package design in the following technologies: FCCSP, Package on Package (PoP), InFO, RDL, IPD, 2.5D/3D, Chiplet

Preferred

Experience in package outline, package routing strategy, bump and Ball Grid Array (BGA) definition and assignment

Experience designing for new packaging technologies and new silicon interfaces/subsystems

Experience in physical verification flow (e.g., LVS, DRC, connectivity)

Experience with CAD for creating simple mechanical drawings, such as Package Outline Drawings (POD)

Understanding of electromagnetic fundamentals for package design optimization

Benefits

Bonus

Equity

Benefits

Company

Google

Glassdoor4.4

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

Founded in 1998

Mountain View, California, USA

10001+ employees

https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (8763)

2024 (8872)

2023 (9682)

2022 (11626)

2021 (9109)

2020 (9785)

Funding

Current Stage

Public Company

Total Funding

$26.1M

Key Investors

Andy Bechtolsheim

2004-08-19IPO

1999-06-07Series Unknown· $25M

1998-11-01Angel· $1M

Leadership Team

Sundar Pichai

CEO

Thomas Kurian

CEO - Google Cloud

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