Intel Corporation · 21 hours ago
Low Yield Analysis Engineer
US, Oregon, Hillsboro
Full-time
Onsite
Entry, Mid Level
$99K/yr - $140K/yr
2+ years expIntel Corporation is a leader in semiconductor manufacturing, dedicated to delivering cutting-edge technology. They are seeking a Low Yield Analysis Engineer responsible for process development and yield improvement through statistical analysis, data interpretation, and cross-functional collaboration.
Semiconductors
Responsibilities
Provides process development direction throughout the whole lifecycle of a technology node by identifying root cause yield limiters
Performs statistical analysis, develops visualizations and presentations to construct accurate process development roadmaps that drive technology yield milestones
Develops methods, processes, and systems to consolidate and analyze diverse big data sources, establishing optimal methodologies for defect mode understanding and yield modeling, leading to accurate yield Pareto construction and process roadmap definition
Organizes, interprets, and structures insights from fab process, defect, and electrical data and detects data anomalies and drives process changes for yield enhancement
Extracts insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics, machine learning and coding techniques
Develops systems to transform complex experimental and manufacturing data into yield improvement actions using knowledge of product design and test features
Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp
Executes new product introductions, enables design technology cooptimization, and participates in design of experiments in factory task forces
Creates cross functional collaborations across organizations to debug yield limiters in design, test, and process development areas
Develops tools, multivariate algorithms, and methodologies to perform high volume data analysis to identify root cause yield limiters and identify key process changes to advance yield improvement
Performs fault isolation and failure analysis to determine the root cause of failures by evaluating the electrical characteristics of the components using various tools and techniques such as ATE testing, DFx software tools, optical probing, logic/circuit simulation, and emulation, probing, and layout study
Develops measurement recipes to provide quick and accurate feedback on product integrity, helping resolve issues with yield or product quality impact
Develops and hardens equipment capable of meeting operational and capability needs for leading edge logic node
Low Yield Analysis (LYA) engineers are responsible for end-of-line failure analysis of the assembly and substrate process and identifying key mechanisms that contribute to ultimate root cause identification
This can relate to specific electrical failures and/or be driven via understanding in-line defect and process health (for Defect Characterization LYA)
Engineers will be expected to conduct hands on lab work, define data acquisition strategies and data analysis plans, and recommend corrective actions/fixes to internal customers
The LYA engineer will utilize strong presentation skills to influence individual process engineers as well as platform teams
Analysis will include both electrical fault isolation (FI) and physical failure analysis (FA) collection
The LYA engineer will also interact with a large team of technicians and provide guidance and mentoring on a wide variety of FI/FA methods and strategies
Other duties may include process and defect characterization and developing innovative techniques/approaches to accelerate failure identification and root cause mechanism understanding
LYA engineers will be expected to provide consultation concerning packaging/assembly challenges and work with partner organizations towards improvements in the manufacturing process
The ability to rapidly respond to customer/client requests or events as they occur while developing solutions utilizing formal education and engineering judgment will be anticipated
Qualification
Required
MS in Chemistry, Physics, Chemical Engineering, Electrical Engineering, Materials Science and Engineering, Mechanical Engineering or other relevant applied engineering degree
BS with 2+ years of relevant experience will be considered
Preferred
Detailed knowledge of some or all of the following characterization techniques: Optical microscopy, SEM, CSAM, analytical techniques (FTIR, Raman, EDS, AFM, XRD, XRF, TXRF)
Experience with sample preparation: mechanical cross-sectioning, ion-mill, planar grinding, de-lidding, and FIB, etc
Detailed knowledge in some or all of the following fault isolation techniques: Curve Tracing, Electrical Hand-probing, EBIC, IBIC, TIVA, LIVA, TDR, EOTPR, SQUID, SSM, ELITE
Experience with statistical data analysis, JMP and JSL, Python, and relational database structure is a plus
Strong assembly process knowledge is a plus
6+ months of relevant work or educational experience in LYA, Yield, Failure Analysis (FA), electrical test, or Quality and Reliability is a plus
Strong problem-solving, analytical and troubleshooting abilities
Good written and oral communication skills
Experience with electronic package or die CAD design software
Benefits
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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