Trispoke Managed Services Pvt. Ltd. · 3 hours ago
Electro Mechanical Design Engineer
Orlando, FL
Contract
Onsite
Mid, Senior Level
3+ years expTrispoke Managed Services Pvt. Ltd. is seeking an ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. The role involves designing, prototyping, and testing cutting-edge packaging solutions while collaborating with various engineering teams to create next-generation electronic systems for aerospace and defense missions.
Outsourcing/Offshoring
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
You will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers
You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware
Your responsibilities will include:
Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets
Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features
Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes
Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback
Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports
Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems
Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance
Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption
Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts
Qualification
Required
CREO: 3-6 years
Materials: 2+ years
CCA experience: 3-6 years
PCB board level design experience: 3+ years
Thermal Analysis: 3+ years
BOM and Windchill Release experience: 3-6 years
Technical Drawing: 3-6 years experience
Packaging experience: 3-6 years
Company
Trispoke Managed Services Pvt. Ltd.
Established in 2022 with an Idea to provide Cost Effective, Best Quality and Tailor Made services to Clients in field of US Staffing, Recruitment, Medical Billing, Staff Augmentation, Customer Support, Virtual Assistant, Accounting and Book-Keeping.
11-50 employees
Funding
Current Stage
Early StageCompany data provided by crunchbase