T-Mobile · 17 hours ago
Software Engineering, Agentic AI Internship
Bellevue, Washington
Internship
Onsite
Intern
$20/hr - $40/hrT-Mobile is a leading innovator in the wireless industry, and they are seeking an intern for their Agentic AI program. This internship provides hands-on experience in designing and implementing software systems that enhance customer engagement through AI-driven solutions.
InternetMobileTelecommunicationsWireless
No H1B
Responsibilities
Working closely with AI/ML engineers, platform engineers, and product teams, you will create reliable, high-performance components that allow our agentic AI to plan, act, and respond intelligently in real time across conversational modalities. This includes developing microservices, workflow engines, and integration layers that connect large language model (LLM) reasoning with network, billing, account, and support systems
Qualification
Required
Coding experience (Python is usually key for AI work)
Understanding of how APIs work
Problem-solving mindset: you need to figure out what customers actually need, not just build cool tech
Communication skills to explain technical work to non-technical stakeholders
Ability to work cross-functionally with product, engineering, and business teams
Comfortable with ambiguity: AI projects rarely have clear-cut answers
Experience with LLMs, prompt engineering, or chatbot frameworks
At least 18 years of age
Legally authorized to work in the United States
High School Diploma or GED
Candidates must be currently enrolled in a degree program and have at least one semester remaining following the internship
Benefits
Relocation may be provided to program participants who reside more than 50 miles from the internship location.
Company
T-Mobile
T-Mobile is a telecommunications company that provides wireless communication services, including mobile phone and internet services. It is a sub-organization of Deutsche Telekom.
Founded in 1994
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$17.37B2026-01-05Post Ipo Debt· $2B
2025-10-06Post Ipo Debt· $2.8B
2024-09-23Post Ipo Debt· $2.5B
Leadership Team
John Saw
President of Technology, Chief Technology Officer
Peter Osvaldik
EVP & CFO
Recent News
2026-02-04
2026-02-04
Company data provided by crunchbase