Intel Corporation · 9 hours ago
Mechanical Design Engineer
US, California, Santa Clara
Full-time
Onsite
Mid Level
$142K/yr - $269K/yr
4+ years expIntel Corporation is seeking a Mechanical Design Engineer to work in the dynamic field of silicon photonics. The role involves developing mechanical and opto-mechanical designs for next-generation optical interconnect products, contributing to Intel's mission in data center optical connectivity.
Semiconductors
Responsibilities
Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (SiPh) devices and assemblies in data center
Package designs and technology selection
Assess and mitigate risks associated with the product designs
Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements
Identify new suppliers for design, develop and manage existing suppliers
Define and conduct overall tolerance analysis for component and sub-assemblies
Design assembly, test tooling and fixturing required for design validation
Interacting with suppliers and optimizing designs based on supplier's processes and capabilities
Creating component drawings, layouts, assembly drawings for product and tooling
Generating Bill of Materials (BOM)
Qualification
Required
BS with 4+ years of experience in product design and development from initial conceptual design to high volume production
3+ years of experience in high volume manufacturing fabrication processes including machining, sheet metal stamping, metal/plastic injection molding and die casting
3+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM, windchill
3+ years of experience working with product documentation, schematics, and Bill of Materials
Preferred
MS or advanced degree is preferred in related engineering field
3+ years of experience in product mechanical design preferably in the fiber optics or semiconductor packaging environment
3+ years of design and assembly experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation
1+ years of experience in the optical/photonics industry
2+ years of experience in product thermal design and knowledgeable on cooling devices and thermal interface materials
1+ years of experience with design simulation for stress and thermal
1+ years of experience in CFD (Computational Fluid Dynamics) modeling tools such as ICEPAK, FLOTHERM, etc
2+ years of experience in FEA (Finite Element Analysis) structural/stress analysis and tools such as Abaqus or ANSYS
2+ years of proven experience in executing complex projects that require cross-functional teamwork is preferred
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
Recent News
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