Micron Technology · 8 hours ago
Intern - Design Architecture, HBM
Micron Technology is a world leader in innovating memory and storage solutions. The HBM Design Architecture Intern supports early-stage research, performance modeling, and tool development that guide future HBM architectural decisions while collaborating with senior engineers and mentors.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Research emerging trends in compute, networking, and storage infrastructure to understand how future AI workloads may evolve
Support HBM architecture analysis by gathering and synthesizing data related to bandwidth, latency, and system-level memory requirements
Help develop or refine simulation frameworks used to model AI cluster performance and memory subsystem behavior
Participate in building trend dashboards using CSP benchmarks and industry datasets
Collaborate with DTPCO mentors to explore architectural intercept opportunities for next-generation AI systems
Qualification
Required
Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field
Foundational understanding of computer architecture, digital systems, and hardware/software interaction
Programming experience in Python, C/C++, or similar languages
Ability to learn new tools, simulation frameworks, and data‑analysis workflows
Preferred
Exposure to AI workload behavior, ML training pipelines, or large‑scale system bottlenecks
Ability to translate research findings into concise technical summaries or recommendations
Benefits
Medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Recent News
2026-02-03
2026-02-03
2026-02-03
Company data provided by crunchbase