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Thermal Design Lead-Client Platforms jobs in United States
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AMD · 21 hours ago

Thermal Design Lead-Client Platforms

AMD is a company focused on building products that enhance computing experiences across various domains. The role involves leading thermal strategy and execution for next-generation CPUs, GPUs, and mobile systems, ensuring effective cooling and performance solutions throughout the product lifecycle.
AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
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Growth Opportunities
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Responsibilities

Lead end-to-end thermal program development for client products (pre-silicon through validation and post-silicon)
Define silicon- and system-level thermal, power, and cooling requirements; author clear customer-facing documentation
Collaborate with CPU/GPU architecture, performance, BIOS/SMU, packaging, and customer engineering teams to align thermal strategies
Own thermal design, modeling (CFD), test, and debug for mobile & desktop platforms, drive design decisions and trade-offs
Develop and validate fan policy/curves; optimize thermal controls for APU/CPU, GPU, and hybrid systems
Diagnose thermal interactions (power, performance, controls) at silicon, package, and system levels; rapidly drive alternative solutions
Ensure delivery of best-in‑class designs by influencing IP floorplans, component placement, and system integration for thermals
Continuously improve processes, methodologies, and automation to accelerate thermal development and validation
Communicate status, risks, and decisions effectively to executives and cross‑functional stakeholders

Qualification

Thermal designCFD modelingThermal validationHeat transferFluid dynamicsMechanical CADThermal components knowledgeExecutive communicationData acquisitionTest planningCollaboration

Required

Lead end-to-end thermal program development for client products (pre-silicon through validation and post-silicon)
Define silicon- and system-level thermal, power, and cooling requirements; author clear customer-facing documentation
Collaborate with CPU/GPU architecture, performance, BIOS/SMU, packaging, and customer engineering teams to align thermal strategies
Own thermal design, modeling (CFD), test, and debug for mobile & desktop platforms, drive design decisions and trade-offs
Develop and validate fan policy/curves; optimize thermal controls for APU/CPU, GPU, and hybrid systems
Diagnose thermal interactions (power, performance, controls) at silicon, package, and system levels; rapidly drive alternative solutions
Ensure delivery of best-in‑class designs by influencing IP floorplans, component placement, and system integration for thermals
Continuously improve processes, methodologies, and automation to accelerate thermal development and validation
Communicate status, risks, and decisions effectively to executives and cross‑functional stakeholders
Deep expertise in heat transfer and fluid dynamics, with hands-on system‑level thermal design experience
Advanced proficiency in CFD for electronics cooling (Icepak and/or Flotherm)
Strong background in thermal validation and debugging of new silicon and system hardware/software issues
Practical knowledge of thermal components and materials (fans, heatsinks, shields, spreaders, TIMs) and how they impact product performance
Ability to analyze and message package thermal resistance impacts (e.g., silicon performance, gen‑on‑gen changes) to internal and external audiences
Proven collaboration across architecture, power/performance, BIOS/firmware, and customer engineering teams
Executive‑level communication skills—able to distill complex technical topics into clear decisions and updates
Extensive lab experience including: Data acquisition and automation, System teardown/rebuild, instrumentation (thermocouples, IR cameras, power/thermal sensors), and test fixture design, System impedance and fan (P-Q curve) characterization using an airflow bench, Test planning, execution, and analysis for thermal performance, acoustics, and skin temperature
Mechanical CAD experience (Creo or SolidWorks)
Experience with Multiphysics modeling and warpage analysis is a bonus
Experience designing and validating fan control policies/curves for client systems
Familiarity with PC architecture and hands-on system setup/testing (VRAM, NVMe, VR, memory, charging circuits)
Understanding firmware-managed power/thermal features and controls across APU/CPU, GPU, and combined systems
Experience influencing IP floorplans and component placement for thermal optimization
BS/MS in Mechanical, Aerospace, Electrical Engineering, or related field
BS + 8 years or MS + 6 years or PhD + 3 years of relevant experience in thermal design, analysis, and validation of electronic systems

Benefits

AMD benefits at a glance.

Company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

Funding

Current Stage
Public Company
Total Funding
unknown
Key Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity

Leadership Team

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Lisa Su
Chair & CEO
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Mark Papermaster
CTO and EVP
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Company data provided by crunchbase