Apple · 19 hours ago
Advanced Package Development Engineer
San Francisco, CA
Full-time
Onsite
Senior Level
$181K/yr - $318K/yr
6+ years expApple is seeking engineers for their Advanced Packaging Program to drive package integration and technology development for next-generation products. The role involves contributing to advanced packaging technologies, solving complex integration challenges, and working with world-class engineers to bring innovations from concept to mass production.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next-generation products
Drive package integration across silicon, firmware, and system teams to ensure co-optimization of die architecture, package design, and thermal/mechanical constraints
Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions
Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high-volume manufacturing
Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions
Qualification
Required
Has deep expertise in semiconductor packaging or related disciplines
Thrives on solving difficult technical problems
Holds themselves to a high standard of engineering excellence
Is self-motivated and comfortable navigating ambiguity
Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next-generation products
Drive package integration across silicon, firmware, and system teams to ensure co-optimization of die architecture, package design, and thermal/mechanical constraints
Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions
Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high-volume manufacturing
Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions
Preferred
PhD and 6+ years of experience in relevant industry preferred
Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc
Deep knowledge of electrical, mechanical and thermal properties of fab materials
Strong expertise in Si Fab equipment and Fab Logistics Management
Experience on advanced packaging for groundbreaking CMOS nodes
Expertise on Si structure yield and reliability mechanisms and analyses
Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
Capable of independent R&D Work in a cross-functional team, driving vendors
Excellent communication skills
Experience in Si fab integration role and advanced packaging
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase