SkyWater Technology · 1 week ago
Advanced Packaging Microelectronics Integration Engineer
Kissimmee, FL
Full-time
Onsite
Senior Level, Lead/Staff
$159K/yr - $238K/yr
10+ years expSkyWater Technology is a company dedicated to manufacturing U.S. made semiconductors that are essential for modern life. They are looking for a Senior Process Integration and Development Engineer to lead and improve the integrated Advanced Packaging process flow at their Florida site, requiring strong communication skills and technical expertise.
AerospaceIndustrialManufacturingService Industry
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Develop / transfer / integrate client advanced package needs into a manufacturing environment that utilizes FanOut, Si interposer and hybrid bonding process flows
Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools
Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
Integrate TSV first and / or TSV last process flows to enable Foundry client packages
Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results
Investigate and drive integration changes for improved device performance and yield improvement
Work with process and tool engineers to find processing marginalities and make improvements
Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes
Utilize data analysis software to drive data driven decisions
Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients
Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package
Create end-to-end process flows to aid in project scoping
The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position
Qualification
Required
BS Engineering
10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environment of 10K and 1K clean rooms
Advanced Packaging Fab processing tools knowledge/experience
MEMS / Photonic / HPC /AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree
Knowledge of DOE, SPC, and 6-sigma concepts and applications
Project Management skills and/or defined training a plus
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes
Can work both independently and in cross-functional teams for problem solving
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship
Preferred
MS/PhD
Benefits
401k match
Life insurance
Opportunities to purchase SkyWater stock at a discounted rate
Medical
Dental
Mental health benefits
Vision
Legal planning
Short- and long-term disability
Paid time off
Paid holidays
An on-site fitness facility
An on-site self-serve market
Company
SkyWater Technology
SkyWater Technology is a semiconductor engineering company that provides development services for circuits and microelectronic devices.
501-1000 employees
Funding
Current Stage
Public CompanyTotal Funding
$345MKey Investors
U.S. Department of Defense
2026-01-26Acquired
2024-11-25Post Ipo Debt· $30M
2023-01-04Post Ipo Debt· $130M
Leadership Team
John Sakamoto
President and COO
Bassel Haddad
SVP and GM, Advanced Packaging
Recent News
2026-02-12
The Motley Fool
2026-02-11
2026-02-11
Company data provided by crunchbase