Teledyne Scientific & Imaging · 15 hours ago
Wafer Dicing Technician
Camarillo, CA
Full-time
Onsite
Mid Level
$52K/yr - $69K/yr
3+ years expTeledyne Scientific & Imaging provides advanced technologies for industrial growth markets. They are seeking a Wafer Dicing Technician to support wafer dicing operations and collaborate with engineers on quality control and process improvements.
Product ResearchProfessional Services
No H1B
U.S. Citizen Only
Responsibilities
Support daily wafer dicing operation that includes container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties
Work with responsible engineers in dicing operation for quality control, process control and continuous improvements in dicing processes and procedures
Document and report any nonconformal event and assist root cause analysis
Work with Manufacturing Execution System (MES) for process execution, data recording and reporting
Follow all laboratory protocols and safety procedures
Qualification
Required
Strong understanding of mechanical drawings on dimensions and tolerances
Ability to use digital microscope and metrology tools
Proficiency with Microsoft Word, PowerPoint, and Excel
Manual dexterity to handle small, precision components
High School Diploma with 3 years of relevant experience
U.S. citizenship due to access restrictions
Benefits
Health, Dental, Vision, and Life Insurance from Day 1
Paid Vacation, Sick Time, and Holidays
401(k) with Company Match
Employee Stock Purchase Plan
Educational Tuition Reimbursement
Fun Employee Events throughout the year
Company
Teledyne Scientific & Imaging
Teledyne Scientific & Imaging provides research and development services in the areas of electronics, imaging sensors. It is a sub-organization of Teledyne Technologies.
201-500 employees
Funding
Current Stage
Growth StageLeadership Team
Tina Doria
Human Resources Business Partner
Recent News
2025-11-27
2025-11-21
2025-09-17
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