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Career Accelerator Program - Applications Engineer - Hardware jobs in United States
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Texas Instruments · 16 hours ago

Career Accelerator Program - Applications Engineer - Hardware

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. They are seeking an Applications Engineer to participate in the Career Accelerator Program, providing technical solutions and support to customers while developing skills in hardware system design and PCB design.
ComputerDSPSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Participate in the Career Accelerator Program (CAP) to accelerate your ramp into TI
Develop skills designing TI Evaluation and Reference PCB boards
Engage with customers virtually and in person to help solve their toughest technical challenges
Promote TI products and provide technical solutions to customers
Provide technical support and engage with customers to help define new products and opportunities for future product development
Work on an applications team in one of TI's product lines to gain a deep understanding of specific products within the business unit
Get exposure to other roles such as Product Marketing, Systems & Digital Marketing through formal learning, projects and on-the-job development experiences

Qualification

Hardware System DesignSignal IntegrityPower IntegrityAnalog CircuitryPCB DesignC/C++ ProgrammingLab Equipment ExperienceTransmission Line TheoryElectromagnetic CompatibilityAnalytical SkillsCommunication SkillsInterpersonal SkillsProblem-Solving SkillsTeam CollaborationTime Management

Required

Bachelors degree in Electrical Engineering, Electronics Technology, Electrical and Computer Engineering or related field
Cumulative 3.0/4.0 GPA or higher

Preferred

Basic understanding of schematics, layouts and digital components
Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
Programming skills in C/C++ (LabView recommended)
Experience with lab equipment, like oscilloscopes, along with soldering and debugging skills
Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
Strong verbal and written communication skills
Ability to quickly ramp on new systems and processes
Demonstrated strong interpersonal, analytical and problem-solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Transmission line theory, semiconductor device physics, signal and power integrity
Stack-up, design rules, impedance control, Power Distribution Network (PDN)
Crosstalk, eye diagrams, return paths, TDR impedance, supply noise, S-parameters
I/O SPICE models, IBIS models, IBIS-AMI models, Thermal models
Synopsys HSPICE, Cadence Spectre, Viva, SystemSI and TopXp, Siemens Hyperlynx
ANSYS SiWave and SiWave-PSI, Cadence OrCad and Allegro, Altium CAD
High-Speed Interfaces: DDR, USB, PCIe, Ethernet, eMMC, OSPI, etc
Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)

Benefits

Competitive pay and benefits designed to help you and your family live your best life

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.

H1B Sponsorship

Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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Company data provided by crunchbase