Sandisk · 10 hours ago
PhD Intern, Packaging Structural Engineering Summer 2026
Sandisk is a leader in innovative data solutions, and they are seeking a PhD Intern in Packaging Structural Engineering. The intern will work on testing, modeling, and simulation in semiconductor packaging, addressing mechanical design and structural reliability issues while contributing to innovative solutions for the data storage industry.
Data StorageManufacturingSemiconductor
Responsibilities
Conducting simulation tasks of mechanical responses of IC package and flash products
Advancing simulation tools for multiscale, multiphysics problems leading to damage and fracture
Analyzing, documenting and reporting testing and simulation results
Proposing engineering solutions to existing and future challenges facing data storage industry
Qualification
Required
Current student, pursuing a Ph.D. degree in Mechanical Engineering or a relevant major graduating in 2027
Interest in microelectronics packaging industry
Proficient in CAD and CAE tools, and a programming language
Proficient in Microsoft Office applications
Demonstrated strong work ethics
Preferred
Exceptional written and verbal communication skill
Company
Sandisk
SanDisk designs, develops, manufactures, and markets data storage solutions in the United States and internationally.
H1B Sponsorship
Sandisk has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (210)
Funding
Current Stage
Public CompanyTotal Funding
$713.58M2025-06-06Post Ipo Secondary· $713.58M
2015-10-21Acquired
1995-11-17IPO
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