Microchip Technology Inc. · 10 hours ago
Senior Engineer I - Packaging
Chandler, AZ
Full-time
Onsite
Mid, Senior Level
$70K/yr - $205K/yr
5+ years expMicrochip Technology Inc. is a leading global organization that designs technology powering the world. The role involves overseeing and managing all aspects of IC package development, including design optimization and qualification processes.
AutomotiveManufacturingSemiconductorWireless
Responsibilities
Work with the designated business units and co-design package solutions that meet the performance, thermal, and reliability requirements for the designated application space
Identify suitable IC package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with multiple third-party assembly sites as well as internal design groups, product engineering, and product marketing and act as the available expert resource for packaging-related aspects of the product
Ensure early success in package development with substantial modeling and simulation for thermal, mechanical and electrical aspects. In addition, act as the thermal and mechanical expert resource for product validation and application teams and end customers for support on system-level solutions
Oversee evaluation and development of new packaging materials and processes
Manage qualifications of new packages or package changes to ensure quality and mitigate risk
Author corporate and supplier-level presentations outlining package roadmaps and package technologies
Author and maintain design rules documents and application notes on package-specific topics
Draft preliminary package outline drawings for internal product development teams
Initiate and follow up on assembly build instructions for all engineering builds
Assist with global cost reduction, standardization and new system implementation projects
Qualification
Required
BSME, BSEE or BS in Chemical Engineering plus 5 years of experience
Experience with advanced laminate (BGA) and QFN package design and assembly
Well-developed knowledge of thermal & electrical simulations, ideally Siemens Flotherm or Ansys Workbench and related tools
Experience with thermal design considerations, including heat sink design and selection
Superior communication and presentation skills and the ability to lead a small team as needed including mentoring junior engineers
Ability to problem-solve and assist the reliability group on FA's on assembly related failures
Knowledge of JEDEC qualification methods for advanced BGA and high-power IC's
Ability to carry out multiple projects simultaneously, set timelines and prioritize projects
Ability to author and comprehend engineering drawings
Familiarity with ANSI Y-14 drafting nomenclature
Travel to Asia occasionally to attend technology reviews and resolve subcon issues
Competence in working with multiple databases, technical acronyms and complex data sets
Preferred
Package Design using Cadence APD
High frequency/SI analysis knowledge
Benefits
Health benefits that begin day one
Retirement savings plans
An industry leading ESPP program with a 2 year look back feature
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
10001+ employees
H1B Sponsorship
Microchip Technology Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (170)
2024 (113)
2023 (116)
2022 (119)
2021 (94)
2020 (100)
Funding
Current Stage
Public CompanyTotal Funding
$2.42BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
2024-03-19Grant· $1.06M
Leadership Team
Steve Sanghi
CEO and President
Rich Simoncic
Chief Operating Officer
Recent News
2026-02-06
2026-01-23
GlobeNewswire
2026-01-22
Company data provided by crunchbase