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Packaging Manufacturing Engineer, Quantum AI jobs in United States
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Google · 11 hours ago

Packaging Manufacturing Engineer, Quantum AI

Google is a leading technology company focused on advancing quantum computing. They are seeking a Packaging Manufacturing Engineer to develop and scale manufacturing processes for quantum computing devices, ensuring efficient operations and reliability in production.
AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
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H1B Sponsor Likelynote

Responsibilities

Develop, characterize, document, and scale manufacturing processes for the packaging of quantum computing devices
Operate, maintain, and troubleshoot key manufacturing equipment
Lead Vendor management (Failure Analysis/RCCA, improve yield and throughput, manage custom workflows, etc.)
Implement and improve internal production processes (including wire bonding, work instructions/procedures, design and build fixtures/jigs, inspections, data hygiene, automation, technician training)
Lead root cause analysis investigations for manufacturing failures and implement effective corrective and preventive actions

Qualification

Mechanical EngineeringElectrical EngineeringManufacturing EngineeringPCB DesignWire BondingStatistical Process ControlDesign of ExperimentsVendor ManagementSix SigmaAutomated InspectionLean Manufacturing

Required

Bachelor's degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience
2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs)
2 years of experience designing, manufacturing, or testing PCBs
2 years of experience managing production processes (vendor management, continuous process improvements, tool ownership, or monitoring and control of existing processes)
Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes

Preferred

Master's degree in Mechanical, Electrical, or Manufacturing Engineering or a related field
2 years of experience in a semiconductor packaging environment
Experience with ESD sensitive devices
Experience with automated inspection and test
Experience in wirebonding processes (e.g., ball, wedge)
Knowledge of Six Sigma or other lean manufacturing methodologies

Benefits

Bonus
Equity
Benefits

Company

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)

Funding

Current Stage
Public Company
Total Funding
$26.1M
Key Investors
Kleiner Perkins,Sequoia CapitalAndy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M

Leadership Team

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Sundar Pichai
CEO
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Thomas Kurian
CEO - Google Cloud
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Company data provided by crunchbase