Impinj · 12 hours ago
Product Applications Engineering Intern
Seattle, WA
Internship
Hybrid
Intern
$26/hr - $40/hrImpinj is a leading RAIN RFID provider and Internet of Things pioneer. They are seeking a Product Applications Engineering Intern specializing in Electrical Engineering to assist in designing experiments and analyzing data related to RAIN RFID applications in food tagging.
Internet of ThingsRFIDSoftware
Responsibilities
Work closely with the applications and platform engineering teams on evaluations and analysis of RFID End Point IC (EPIC) efficacy on different types of foods and packaging
Write detailed reports on the characterization and tests performed
Define standard operating procedures (SOPs) and optimize SOPs based on experiments
Analyze inlays through a variety of tests including Anechoic chamber measurements
Configure and execute test automation software
Catalogue samples sent from partners
Communicate with the larger team regarding test status, analysis and any issues
Qualification
Required
Currently enrolled in a Bachelor's or Master's program in Electrical Engineering, Computer Engineering, Physics, or a related field
Understanding of basic RF principles is a plus
Ability to script in Python or equivalent
Demonstrates leadership initiative and self-sufficiency while valuing and contributing to teamwork
Proactively pursues skill development and demonstrates rapid learning capability
Proactively identifies issues in the work processes and demonstrates enthusiasm for researching and implementing solutions with an attention to detail
Excellent communication and interpersonal skills
Benefits
Healthcare benefits
401(k) plan and company match
Open paid time-off policy
Company
Impinj
Impinj is a provider of RAIN RFID solutions that deliver Item Intelligence to retail, healthcare and other industries.
Founded in 2000
201-500 employees
H1B Sponsorship
Impinj has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2023 (1)
2021 (1)
2020 (4)
Funding
Current Stage
Public CompanyTotal Funding
$307.28MKey Investors
ARCH Venture Partners,GF Private Equity,Intel Capital,Madrona,Mobius Venture Capital,Polaris PartnersAllianceBernsteinGF Private Equity
2025-09-04Post Ipo Debt· $170M
2016-07-21IPO
2012-07-26Series Unknown· $21M
Leadership Team
Chris Diorio
CEO, Founder
Alberto Pesavento
Chief Technology Officer
Recent News
2026-02-06
2026-01-22
Benzinga.com
2026-01-16
Company data provided by crunchbase