NVIDIA · 11 hours ago
Senior Package Layout Engineer - Hardware
United States
Full-time
Remote
Senior Level
$136K/yr - $213K/yr
5+ years expNVIDIA is a leader in GPU and SOC technology, seeking a hard-working Senior Package Layout Engineer to contribute to innovative solutions. The role involves collaborating with design teams to create detailed layouts for IC substrates, optimizing designs, and improving layout productivity.
AI InfrastructureArtificial Intelligence (AI)Consumer ElectronicsFoundational AIGPUHardwareSoftwareVirtual Reality
Responsibilities
As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
Perform substrate breakout patterns for ASIC packages
Optimize package pinout incorporating system level trade-offs of pins assignment
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity
Qualification
Required
Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Solid understanding of high-speed design signal integrity practices
Preferred
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Experience with Virtuoso and Calibre is a plus
Experience using Valor is helpful
Benefits
Equity
Benefits
Company
NVIDIA
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
10001+ employees
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (1877)
2024 (1355)
2023 (976)
2022 (835)
2021 (601)
2020 (529)
Funding
Current Stage
Public CompanyTotal Funding
$4.09BKey Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity
Leadership Team
Jensen Huang
Founder and CEO
Michael Kagan
Chief Technology Officer
Recent News
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