Amkor Technology, Inc. · 12 hours ago
Director, Chiplets/FCBGA Integration
Tempe, AZ
Full-time
Hybrid
Director/Executive
10+ years expAmkor Technology, Inc. is currently seeking a Director, Chiplets and FCBGA for their Tempe, AZ office. The primary function of this position is program management for the development of advanced chiplet-based IC Packages, serving as the primary interface with Tier 1 customers and Amkor's R&D center.
ElectronicsSemiconductorWireless
Responsibilities
Drive and coordinate development activities with customers, in conjunction with Amkor's R&D development teams in Korea
Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase
Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams
Manage customer product management through the development phase and into initial production ramp
Qualification
Required
Bachelor's Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master's degree is a plus
10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging
The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages
A working knowledge of mechanical stress/strain and IC package warpage is required
Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required
Excellent written and verbal communication skills are needed
This position requires 10-20% travel including domestic and international travel
Preferred
Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs
Mechanical or Thermal simulation experience
Familiarity with Design of Experiments and Statistical Process Control
Company
Amkor Technology, Inc.
Amkor Technology, Inc.
10001+ employees
H1B Sponsorship
Amkor Technology, Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (7)
2024 (5)
2023 (7)
2022 (6)
2021 (6)
2020 (9)
Funding
Current Stage
Public CompanyTotal Funding
$1.24B2025-09-08Post Ipo Debt· $500M
2025-07-28Post Ipo Debt· $500M
2023-09-06Post Ipo Secondary· $240M
Leadership Team
AMADO ROBLES
DIRECTOR - fcCSP, fcSiP, Hybrid CSP
Recent News
Korea Herald
2026-01-07
2026-01-07
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