Amkor Technology, Inc. · 1 day ago
Director, Chiplets/FCBGA BU
Tempe, AZ
Full-time
Onsite
Director/Executive
10+ years expAmkor Technology, Inc. is seeking a Director for their Chiplets/FCBGA Business Unit in Tempe, AZ. The primary function of this role involves program management and managing key customer accounts while driving internal process development and co-development programs to support customers and production of FCBGA products.
ElectronicsSemiconductorWireless
Hiring Manager
Erin Coté Martin
Responsibilities
Partner with BU members to achieve annual goals, while managing customer relationships to grow market share
Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business
Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements
Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them
Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution
Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs
Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp
Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets
Qualification
Required
This position requires a Bachelor's degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines)
10+ years of demonstrated industry experience required, with semiconductor packaging experience required
Familiarity with Design of Experiments and Statistical Process Control is needed
Previous project management experience is a required
Knowledge of material and package characterization data analysis, test methods and qualification procedures are required
Strong understanding of wafer bump, assembly processes and techniques is necessary
Experience with cost modeling, pricing, quoting activities and products is needed
Proven ability to multiplex across numerous programs and teams is essential. Experience working with offshore factories is a plus
Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment. Ability to work independently in a heavily matrixed organization
Requires excellent, demonstrated written and verbal communication skills
Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
This position can require up to 10% travel
Preferred
Flip Chip package design and OSAT experience will be a plus
Experience working with external customers is highly preferred
Company
Amkor Technology, Inc.
Amkor Technology, Inc.
10001+ employees
H1B Sponsorship
Amkor Technology, Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (7)
2024 (5)
2023 (7)
2022 (6)
2021 (6)
2020 (9)
Funding
Current Stage
Public CompanyTotal Funding
$1.24B2025-09-08Post Ipo Debt· $500M
2025-07-28Post Ipo Debt· $500M
2023-09-06Post Ipo Secondary· $240M
Leadership Team
AMADO ROBLES
DIRECTOR - fcCSP, fcSiP, Hybrid CSP
Recent News
Korea Herald
2026-01-07
2026-01-07
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