Microsoft · 16 hours ago
Senior Signal Integrity and Power Integrity Engineer
United States, Texas, Austin
Full-time
Hybrid
Mid, Senior Level
$120K/yr - $235K/yr
5+ years expMicrosoft is a leading technology company focused on cloud infrastructure and hardware engineering. They are seeking a Senior Signal Integrity and Power Integrity Engineer to develop advanced power delivery and signaling solutions for High Performance Computing silicon designs, contributing to the optimization of their cloud infrastructure.
Agentic AIApplication Performance ManagementArtificial Intelligence (AI)Business DevelopmentDevOpsInformation ServicesInformation TechnologyManagement Information SystemsNetwork SecuritySoftware
Responsibilities
Implementing strategies for end-to-end signal integrity design from Silicon to Package, and linking to Platform to System and Cloud
Delivering SIPI solutions that meet the HPC demands across the entire system
Driving future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes
Designing, modeling, and simulating SI and PI for data center processors and corresponding platforms to ensure optimized performance. Performs link/electrical simulations to validate I/O performance from platform to silicon
Working closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers
Driving the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines
Driving engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs
Qualification
Required
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
Preferred
MSEE degree with 10 years' experience in silicon packaging products development
Experience with high-speed signal design and power integrity modelling for HPC products
Strong foundation in advanced packaging technologies as it relates to Signal and Power integrity
Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies
MS degree with minimum 5+ years of experience in silicon/package/system signal integrity and power delivery OR: BSEE degree with minimum 10 years' experience in silicon/package/system signal integrity and power delivery
Strong foundation and expert in the field of Signal and Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 5 years' experience in design and electrical modelling
Good working knowledge in the field of end-to-end system SIPI Design and Architecture
Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design
Excellent interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation
Company
Microsoft
Microsoft is a software corporation that develops, manufactures, licenses, supports, and sells a range of software products and services.
10001+ employees
H1B Sponsorship
Microsoft has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (9192)
2024 (9343)
2023 (7677)
2022 (11403)
2021 (7210)
2020 (7852)
Funding
Current Stage
Public CompanyTotal Funding
$1MKey Investors
Technology Venture Investors
2022-12-09Post Ipo Equity
1986-03-13IPO
1981-09-01Series Unknown· $1M
Leadership Team
Satya Nadella
Chairman and CEO
Vukani Mngxati
Chief Executive Officer - Microsft South Africa
Recent News
2026-01-16
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2026-01-16
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