AMD · 2 hours ago
Advanced Packaging Technologist
Austin, TX
Full-time
Onsite
Senior LevelAMD is a company focused on building innovative products that enhance computing experiences across various domains. In this role, you will lead the development of next-generation thermal technologies, utilizing model-based decision-making to guide architectural definitions and technology directions.
AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
No H1B
Responsibilities
Lead model-based thermal architecture development to support technology pathfinding and product roadmapping
Partner with package and system architects to deliver thermally optimized end-to-end solutions as part of System-Technology Co-Optimization (STCO)
Collaborate with silicon design teams to enable thermally optimized power and performance while maintaining thermal margins, reliability, and long-term robustness
Define and execute characterization and validation strategies, partnering with internal and external thermal laboratories to calibrate and correlate models
Manage consortium and academic research engagements focused on advanced thermal technologies and modeling methodologies
Participate in technology reviews and evaluations with vendors and external partners
Define targets and strategic direction for thermal technology development, assess technology readiness, and influence AMD product roadmaps
Serve as thermal subject-matter expert within advanced packaging and technology integration, ensuring cohesive, end-to-end thermal solutions with a primary focus on data center applications
Qualification
Required
Lead model-based thermal architecture development to support technology pathfinding and product roadmapping
Partner with package and system architects to deliver thermally optimized end-to-end solutions as part of System-Technology Co-Optimization (STCO)
Collaborate with silicon design teams to enable thermally optimized power and performance while maintaining thermal margins, reliability, and long-term robustness
Define and execute characterization and validation strategies, partnering with internal and external thermal laboratories to calibrate and correlate models
Manage consortium and academic research engagements focused on advanced thermal technologies and modeling methodologies
Participate in technology reviews and evaluations with vendors and external partners
Define targets and strategic direction for thermal technology development, assess technology readiness, and influence AMD product roadmaps
Serve as thermal subject-matter expert within advanced packaging and technology integration, ensuring cohesive, end-to-end thermal solutions with a primary focus on data center applications
MS or PhD in relevant Engineering disciplines or physics
Preferred
Direct experience in package- and system-level thermal modeling, coupled with experimental validation and characterization
Solid foundation in heat transfer, fluid dynamics, and materials science, with the ability to apply first-principles understanding to multi-physics package-and-system-level design trade-offs
Strong working knowledge of cooling and packaging technologies, including cold plates, vapor chambers, air-cooled heat sinks, thermal interface materials (TIMs), immersion cooling, microfluidics, and electronic packaging architectures
Experience developing cooling solutions across a range of platforms, including data centers (server- and rack-level cooling), servers (air- and liquid-cooled), mobile systems (laptops and notebooks), and workstations
Proven relevant industry or research experience in thermal engineering, electronics packaging, or related fields
Benefits
AMD benefits at a glance.
Company
AMD
Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.
Founded in 1969
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
unknownKey Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity
Leadership Team
Lisa Su
Chair & CEO
Mark Papermaster
CTO and EVP
Recent News
2026-02-06
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2026-02-06
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