AMD · 14 hours ago
Advanced Packaging Technologist
Austin, TX
Full-time
Onsite
Senior Level
$142K/yr - $212K/yrAMD is a company that builds products accelerating next-generation computing experiences. The Advanced Packaging Technologist role involves driving model-based architecture and design decisions for advanced PCB technologies while collaborating with various teams to influence product and platform roadmaps.
AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
No H1B
Responsibilities
Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations
Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform
Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies
Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs
Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps
Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures with a primary focus on data center platforms
Qualification
Required
Self-directed technical leader who operates with a high degree of autonomy
Ability to communicate with clarity and collaborate effectively across teams
Ownership of modeling rigor and experimental grounding for STCO-driven architecture & design decisions
Influence product and platform roadmaps for data center and high-performance computing systems
Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies
Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical)
Drive validation strategies partnering with internal and external labs
Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes
Engage with PCB suppliers, EMS partners, and component vendors
Define targets and strategic direction for mechanical and PCB technology development
Assess technology readiness and influence product roadmaps
Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures
Preferred
Demonstrated experience owning model-based architecture & design decisions
Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control
Solid foundation in Mechanics, Fracture, Materials, Design & FEA
Experience influencing SMT processes, connectors, and mechanical assembly strategies
Experience integrating electro-thermal and electro-optical technologies at the board and package level
Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles
Benefits
AMD benefits at a glance.
Company
AMD
Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.
Founded in 1969
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
unknownKey Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity
Leadership Team
Lisa Su
Chair & CEO
Mark Papermaster
CTO and EVP
Recent News
2026-02-06
The Next Platform
2026-02-06
2026-02-06
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