American Semiconductor · 4 months ago
Lead Hardware Engineer
American Semiconductor is seeking a Lead Hardware Engineer to engineer new capabilities for package and board level design and assembly. The role involves planning and conducting hardware and system design, manufacturing, and testing, with responsibilities including board design, package design, and customer technical communication.
ElectronicsManufacturingSemiconductor
Responsibilities
Package and Board development including flexible circuit board (FCB) systems using state-of-the-art ultra-thin flexible ICs
Design and development of SoP WLCSP for customer ICs
Hardware engineering support for all areas of design, packaging, assembly and test
Leading level 1-3 engineers or technicians directly as a group-wide subject matter expert
Technical and project documentation creation, maintenance and reporting as necessary
Qualification
Required
Experience in PCB/FCB system design, layout and evaluation
Mixed-signal and/or RF product design, layout and testing ability
Hands on experience in design and hardware verification using automated waferscale probe, logic analyzers, bus analyzers and digital scopes, etc
Excellent analytical and problem-solving skills
Strong communication, interpersonal, and planning skills
Current or former lead engineer of a group
Mixed-signal and/or RF hardware experience or related academic course work is mandatory
Traditional or flexible circuit board design experience
B.S. in Electrical Engineering, M.S. in Electrical Engineering or related degree with 7 years of related experience
Ability to obtain and maintain a Department of Defense security clearance
Pro-active, innovative and energetic
Must have a can-do attitude, hands-on and able to multi-task
Good written and oral communication skills are a requirement for both team leadership and customer-facing communication
Aptitude and ability to make things is highly valued, and can be evidenced by work or non-work experience related to electronics, computer, electrical, hardware fabrication or mechanics
Preferred
Experience in traditional or flexible circuit board design
Benefits
Medical benefits are part of the total compensation package.
This position may include significant stock options for participation in the growth of the company.
Company
American Semiconductor
ASI's thin-device manufacturing capability is based on Semiconductor-on-Polymer™ advanced packaging--making the thinnest devices possible.
Funding
Current Stage
Early StageTotal Funding
unknown2017-02-15Angel
Recent News
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2025-02-17
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