Intel Corporation · 12 hours ago
Packaging Module Process Development Engineer
US, Arizona, Phoenix
Full-time
Onsite
Mid, Senior Level
$134K/yr - $220K/yr
4+ years expIntel Corporation is a leading technology company focused on semiconductor manufacturing and innovation. They are seeking a Packaging Module Process Development Engineer to develop and optimize assembly processes, ensuring quality and efficiency in manufacturing while innovating new techniques for packaging solutions.
Semiconductors
Responsibilities
Develops assembly processes and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones
Qualification
Required
The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related field with 6+ years of industry experience
-OR- Master's degree in Engineering, Physics, Chemistry or related field with 4+ years of industry experience
-OR- PhD degree in Engineering, Physics, Chemistry or related field with 2+ years of industry experience
Preferred
Preference for experience with dispense and/or material development
Product ownership, change control management and data systems
Project management and delivering results for time critical technical projects
Technical innovation and deliver results for complex, time critical technical projects
Semiconductor fabrication processes and technology
Demonstrate experience of Statistical Process Control (SPC) and Design of Experiments (DOE) principles
Excellent verbal and written communication skills
Benefits
Competitive pay
Stock bonuses
Benefit programs which include health, retirement, and vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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