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Internship - System Performance Engineering jobs in United States
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ASML · 12 hours ago

Internship - System Performance Engineering

ASML is a leading company in lithography machines for microchip production, seeking an intern to work with Cymer DUV Systems Engineering on excimer laser technology. The intern will focus on developing characterization tools and gaining experience in laser optics, metrology, and performance while collaborating with industry experts.
CommercialElectronicsHardwareIndustrialIndustrial ManufacturingMachinery ManufacturingManufacturingNanotechnologySemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Work with Cymer DUV Systems Engineering to develop next generation excimer laser technology
Focus on driving and improving tools and characterization of laser
Provide key insight into the lithography application and characterization of the laser light source and lithography scanner interaction
Gain experience in excimer laser optics, laser metrology and laser performance
Setup, implement and document experimental laser setups as well as data analysis and modelling of proposed solutions

Qualification

Data Analysis SoftwareLaserOptical EngineeringMechanical Design SoftwareOptical Ray Tracking SoftwareExperimental Setup DesignMS Office SuiteTeam CollaborationCommunication SkillsSelf-Motivation

Required

Must be pursuing a Master's or PhD in Physics, Electrical Engineering, Mechanical Engineering, Optical Engineering, Chemistry or related discipline
Demonstrated creativity in solving complex design problems
Experience using Data Analysis Software (Matlab, Python, Origin, Igor, etc.) and Data Accusations (LabVIEW etc.) required
Ability to use MS Word, Excel, PowerPoint, and electronic e-mail systems
Ability to work either independently or as part of a development team
Self-motivation and ability to work in a fast-moving high-tech environment
Excellent written and verbal communication skills
Ability to translate, statistically analyze data, and effectively report problems through written and/or graphical formats
Be a demonstrated “team player” with a quality orientation and interpersonal
Excellent customer service skills, with an advanced understanding of customer relationship building
Can work under deadlines
Must be able to read and interpret data, information, and documents
Can observe and respond to people and situations and interact with others encountered in the course of work
Can learn and apply new information or skills
Routinely required to sit; walk; talk; hear; use hands to keyboard, finger, handle and feel; stoop, kneel, crouch, twist, reach and stretch
Occasionally required to move around the campus
Occasionally lift and/or move up to 50 pounds
Specific vision abilities required by this job include close vision, color vision, peripheral vision, depth perception and ability to adjust focus
Must be willing to work in a clean room environment, wearing coveralls, hoods, booties, safety glasses and gloves for entire duration of shift
Must be able to work in small, confined spaces
Qualified candidates must be legally authorized to access controlled technology prior to beginning work

Preferred

Knowledge of laser and optical engineering principles preferred
Experience using Mechanical Design Software (Creo/ProE, NX, CATIA, Solidworks, etc.) preferred
Experience using Optical ray tracking Software (Zemax, Code 5, Oslo, etc.) preferred
Experience designing, specifying components for, and building experimental setups and prototype builds preferred

Company

ASML is a manufacturer of chip-making equipment.

H1B Sponsorship

ASML has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (460)
2024 (354)
2023 (538)
2022 (443)
2021 (196)
2020 (279)

Funding

Current Stage
Public Company
Total Funding
$526.46M
2022-05-10Post Ipo Debt· $526.46M
1995-03-24IPO

Leadership Team

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Christophe Fouquet
President and Chief Executive Officer
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Marco Pieters
Chief Technology Officer
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Company data provided by crunchbase